【摘要】：微細加工在許多工業(yè)領域中有著重要而廣闊的應用前景。金屬電沉積是指利用電化學原理,在外接電場作用下,陽極與陰極通過電沉積液連成回路,沉積液中的金屬離子沉積到陰極表面上的過程。當金屬達到納米尺度時,會出現(xiàn)一些新的效應,如量子尺寸效應、小尺寸效應和宏觀量子隧道效應等。這些效應往往同時起作用,并由此導致納米材料的力、熱、光、電,磁,以及化學性能與其對應的塊體材料不同。基于已有的微細加工技術基礎,本文提出利用毛細管輔助微細電沉積制備金屬結構的新方法,該方法以獨特設計的微電極作為電沉積反應中的陽極,結合局部電沉積微加工技術,能夠快速、簡單地實現(xiàn)金屬微結構制備。本課題主要從理論分析、實驗裝置系統(tǒng)設計、數(shù)值模擬仿真及工藝試驗分析這幾個方面對這種金屬微結構制備方法進行研究,主要研究內容及創(chuàng)新點如下:(1)提出一種毛細管輔助微細電沉積制備金屬結構的加工方法。該方法是利用毛細玻璃管作為絕緣裝置,微細鉑絲插入毛細管內部并與其底部管口齊平作為電化學反應中的陽極。陽極固定在Z向高精度電控平移臺上,在自動控制系統(tǒng)的控制下能實現(xiàn)微細金屬結構的快速且高效制備。(2)利用COMSOL Multiphysics仿真軟件對微細電沉積制備金屬銅柱結構的過程進行電場數(shù)值模擬。分別針對未套有絕緣裝置和套有絕緣裝置(毛細管)的兩種物理模型進行仿真研究,從理論上驗證毛細管輔助微細電沉積制備金屬結構的可行性。(3)設計并搭建以毛細管輔助微細電沉積進行微細加工的試驗系統(tǒng)平臺。完成核心電沉積加工單元的設計、步進系統(tǒng)的自動控制以及利用CCD監(jiān)控系統(tǒng)對沉積過程進行實時監(jiān)測,及時完成各項工藝參數(shù)的調整。(4)為探究微細金屬結構生長的最佳工藝參數(shù),以制備微細金屬銅柱為例,分別從脈沖電源的工作電壓和占空比兩種工藝參數(shù)進行加工試驗,得出制備銅柱的最佳工藝參數(shù)。在此研究基礎上,根據(jù)制備微細銅柱的最佳電參數(shù)來進一步指導其他微細金屬結構的制備過程,并由此獲得不同的微細金屬結構。
[Abstract]:Micro-machining has an important and broad application prospect in many industrial fields. Metal electrodeposition refers to the process of metal ion deposition on the surface of cathode under the action of electrochemistry and external electric field, and the anode and cathode are connected through the electrodeposition liquid to form a loop, and the metal ions in the deposition solution are deposited on the surface of the cathode. When metal reaches nanometer scale, some new effects will appear, such as quantum size effect, small size effect and macroscopic quantum tunneling effect. These effects often work at the same time, which leads to the force, heat, light, electricity, magnetic, and chemical properties of nanomaterials being different from their corresponding bulk materials. Based on the existing micromachining technology, a new method for the preparation of metal structures by capillary assisted micro-electrodeposition is proposed, in which the uniquely designed microelectrode is used as the anode in electrodeposition reaction. Combined with local electrodeposition micromachining technology, metal microstructures can be fabricated quickly and simply. In this paper, the preparation methods of the metal microstructures are studied from the aspects of theoretical analysis, experimental device system design, numerical simulation and process test analysis. The main research contents and innovations are as follows: (1) A capillary assisted micro-electrodeposition method is proposed to prepare metal structures. In this method, the capillary glass tube is used as the insulating device, the thin platinum wire is inserted into the capillary tube and is used as the anode in the electrochemical reaction. The anode is fixed on the Z direction high precision electronic control translation platform, Under the control of automatic control system, micro metal structure can be fabricated quickly and efficiently. (2) the electric field numerical simulation of micro electrodeposition process of metal copper column structure is carried out by using COMSOL Multiphysics software. Two kinds of physical models of uninsulated devices and capillaries (capillary tubes) were simulated and studied respectively. The feasibility of preparing metal structure by capillary assisted micro electrodeposition was verified theoretically. (3) A test system platform for micro electrodeposition with capillary assisted micro electrodeposition was designed and built. Complete the design of the core electrodeposition processing unit, the automatic control of the step system and the real-time monitoring of the deposition process by using the CCD monitoring system. (4) in order to explore the best technological parameters for the growth of micro-metal structure, taking the preparation of micro-metal copper column as an example, the processing tests were carried out from the working voltage and duty cycle of the pulse power supply. The optimum technological parameters for the preparation of copper column were obtained. On the basis of this study, the preparation process of other micro-metal structures is further guided by the optimum electrical parameters of the preparation of copper microcolumns, and different micro-metal structures are obtained.
【學位授予單位】：南京航空航天大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TG662

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