本文選題：投影式光刻系統(tǒng)　切入點：套刻對準(zhǔn)　出處：《廣東工業(yè)大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：隨著信息化產(chǎn)業(yè)的快速發(fā)展,光刻技術(shù)已經(jīng)成為制約超大規(guī)模集成電路以及微光學(xué)元器件制作的核心技術(shù)。光學(xué)曝光光刻技術(shù)經(jīng)歷了接觸式光刻、接近式光刻、光學(xué)投影式光刻及激光干涉光刻等典型光刻技術(shù)進程。由于光學(xué)投影式光刻在技術(shù)成熟性以及設(shè)備穩(wěn)定性方面優(yōu)勢明顯,目前市場廣泛應(yīng)用的還是投影式曝光光刻技術(shù)。作為光刻技術(shù)的承載平臺,同時扮演現(xiàn)代半導(dǎo)體工業(yè)與電子技術(shù)工業(yè)孵化器角色的光學(xué)投影式光刻系統(tǒng),其主要組成部分包括曝光光源、光刻投影物鏡、掩膜硅片對準(zhǔn)系統(tǒng)、激光定位工作臺。針對實驗室現(xiàn)有的準(zhǔn)分子激光投影光刻機系統(tǒng),本文就其中的掩膜硅片對準(zhǔn)系統(tǒng)、曝光光源兩個部分展開了相關(guān)研究工作。在本文中,第一章綜述了課題的背景,光刻系統(tǒng)的分類,國內(nèi)外研究現(xiàn)狀,課題研究的目的與意義,以及本論文主要研究內(nèi)容。第二章詳細(xì)介紹了整個投影光刻套刻技術(shù)理論,對準(zhǔn)技術(shù)及其分類,以及影響光刻機系統(tǒng)的各主要因素,分析了各主要對準(zhǔn)方法的優(yōu)缺點。針對目前套刻對準(zhǔn)技術(shù)發(fā)展的現(xiàn)狀,在第三章中我們針對高精度的投影套刻對位系統(tǒng),研究并提出了一種新型的對準(zhǔn)與匹配算法。該算法的核心是一個經(jīng)嚴(yán)格推導(dǎo)的,國內(nèi)外未見報道的仿射變換“單應(yīng)矩陣計算式”,同時利用輪廓線插值特征點匹配的方式來尋求對位參量。首先,利用質(zhì)心法分別求出掩模圖與硅板圖相應(yīng)ROI區(qū)域中經(jīng)過特征點提取后得到的點集質(zhì)心；然后對點集中各點依據(jù)與質(zhì)心點的歐氏距離的大小有序的方式進行排序；最后根據(jù)“單應(yīng)矩陣計算式”,以直接的單步運算即可高精度求得待對準(zhǔn)的旋轉(zhuǎn)平移量,取代傳統(tǒng)方法需要收斂迭代的耗時運算過程,實現(xiàn)光刻機實時對位系統(tǒng)的要求。第四章是主要是對相應(yīng)系統(tǒng)軟件進行簡要介紹,同時進行相應(yīng)的算法演示以及實驗分析,通過對實驗結(jié)果圖像的分析,結(jié)合系統(tǒng)中所選用的光學(xué)顯微物鏡組的實際MTF曲線,對系統(tǒng)的精度以及誤差進行評價。實驗結(jié)果表明該系統(tǒng)具有較高的精度,較強的魯棒性,可實現(xiàn)實時對位的關(guān)鍵實用需求。在第五章中,介紹了如何在現(xiàn)有紫外準(zhǔn)分子激光器基礎(chǔ)上獲得一個均勻平頂光束的方法,在理論上結(jié)合高斯-謝爾模型和部分相干光理論,得到可以產(chǎn)生平頂均勻光束的一組參數(shù)。為以后利用現(xiàn)有實驗條件,結(jié)合所提出的對準(zhǔn)系統(tǒng)展開相關(guān)光刻的研究工作做好了鋪墊�？偟恼f,本論文的創(chuàng)新之處在于依據(jù)實際套刻對準(zhǔn)系統(tǒng)中的簡化數(shù)學(xué)模型為基本無縮放的仿射變換,并在該仿射變換模型的基礎(chǔ)上,利用嚴(yán)格的數(shù)學(xué)推導(dǎo),得到一組可以一步求出待求變換參量的單應(yīng)矩陣計算式,可以避免傳統(tǒng)計算方法中求取變換參量需要迭代運算的耗時環(huán)節(jié)：并在該式的基礎(chǔ)上結(jié)合數(shù)字圖像處理相關(guān)技術(shù),設(shè)計了一套可以實現(xiàn)實時對準(zhǔn)功能的軟件系統(tǒng),實現(xiàn)了光學(xué)投影式光刻系統(tǒng)中套刻對準(zhǔn)技術(shù)的關(guān)鍵核心。
[Abstract]:With the rapid development of the information industry, lithography technology has become the core of VLSI and micro optical components made of optical lithography. Through contact lithography, lithography, optical projection lithography and laser interference lithography and other typical lithography process. Because the optical projection lithography in the mature technology and equipment the stability of obvious advantages, is widely used in market or projection lithography. As the bearing platform of lithography technology, optical projection lithography system also plays the role of modern semiconductor industry and electronic technology industry incubator role, the main components including the exposure light source, lithographic mask and wafer alignment, laser positioning according to the laboratory bench. The existing excimer laser projection lithography system, in this paper, the mask of silicon wafer Alignment system, exposure of the two part of the light source in the research work. In this paper, the first chapter reviews the background of the topic, the classification of lithography system, the research status at home and abroad, the research purpose and significance, and the main contents of the thesis. The second chapter introduces the whole projection lithography lithography technology theory, alignment the technology and its classification, and main factors affecting the lithography system, analyzes the advantages and disadvantages of the main alignment method. Aiming at the alignment technology development status, in the third chapter we are aiming at high precision projection lithography alignment system, this paper proposed a new alignment with the core of the matching algorithm. The algorithm is a rigorous derivation of the affine transformation "has not been reported at home and abroad of the homography matrix, the calculation formula of" contour interpolation feature point matching way to seek for a first parameter at the same time. First, using the centroid method calculates the centroid of mask graph and silicon plate map corresponding to ROI region after feature extraction from point set; and then sort the point size of the Euclidean distance of each point and the centroid point according to an orderly manner; finally, according to the "formula" homography matrix in single step operation you can directly obtain high precision rotation and translation to be aligned, to replace the traditional method requires time-consuming iterative computing process, realize the real-time positioning system of the lithography requirements. The fourth chapter is mainly a brief introduction to the corresponding system software, at the same time. The corresponding algorithm demonstration and experimental analysis, through the analysis of the experimental results of image and combined with the system of optical lens practical MTF curve to evaluate the system's accuracy and error. Experimental results show that the system has high precision, strong Shandong Bar, key functional requirements can realize real-time positioning. In the fifth chapter, introduces the method of how to obtain a uniform beam based on the existing UV excimer laser, in theory with Gauss Schell model and theory of partially coherent light, can get a set of parameter's top uniform beam. After using the existing experimental conditions, the research work with the proposed alignment system to start the lithography to pave the way for. In general, the innovation of this paper is on the basis of the actual alignment system for the simplified mathematical model of affine transformation basically no zoom, and based on the affine transformation model, using mathematical deduction strictly, a group can be a step for the unknown parameters of the homography matrix transform formula can avoid calculating transformation parameter iterative algorithms, time-consuming traditional calculation methods and links: Based on this formula, combined with the technology of digital image processing, a set of software system that can achieve real-time alignment function is designed, and the core of alignment technology in optical projection lithography system is realized.

【學(xué)位授予單位】：廣東工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN305.7

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