本文選題：LTCC工藝 + 微波電容��； 參考：《電子科技大學(xué)》2014年碩士論文

【摘要】：電容作為現(xiàn)代無(wú)線通信系統(tǒng)中的一類(lèi)重要的基本元器件,決定著整個(gè)系統(tǒng)性能的好壞。在實(shí)際電路中電容一般用于旁路和去耦電路。隨著通信系統(tǒng)“集成化、高速化”的發(fā)展趨勢(shì),對(duì)電容的“高頻化、小型化”有了更高的要求。因此對(duì)微波電容的研究勢(shì)在必行。本文主要分析高頻下電容等效電路模型,研究電容器的特征參數(shù)(諧振頻率、Q值)與物理尺寸、鍵合方式的關(guān)系,進(jìn)而提取等效電路參數(shù)。然后利用低溫共燒陶瓷工藝LTCC(Low Temperature Co-fired Ceramic)生產(chǎn)不同尺寸用于高頻電路的微波電容,同時(shí)對(duì)工藝流程中的燒結(jié)和鍍電極過(guò)程出現(xiàn)的不足之處做出改進(jìn)。最后設(shè)計(jì)了一款用于測(cè)量微波電容測(cè)試校準(zhǔn)的工具(TRL校準(zhǔn)件),提高了微波電容測(cè)試的精度。全文主要內(nèi)容包括:首先介紹微波電容的設(shè)計(jì)基礎(chǔ),闡述了電容器的品質(zhì)因數(shù)和有效容值等基本概念,為建立等效電路模型奠定理論基礎(chǔ),進(jìn)而給出了兩種不同的等效模型。通過(guò)對(duì)電容器損耗的分析,可以得出電容器的損耗是隨頻率的升高而增大的。因此,提高電容器的諧振頻率是以損失其品質(zhì)因數(shù)為代價(jià)的。其次,以0.5mm×0.5mm×0.2mm電容為例,在HFSS中建立不同連接方式的電容物理模型,通過(guò)電容器的電流在同一端比在兩端時(shí)的諧振頻率高。電容器在實(shí)際電路中是以金絲鍵合方式來(lái)連接的,因此還分析了金絲線本身的微波性能,同時(shí)對(duì)使用金絲鍵合電容用π型等效電路做了擬合。最后,由于微波電容的工作頻率較高,此時(shí),接頭到電容之間的寄生參量對(duì)測(cè)量結(jié)果影響較大。因此,為了提高測(cè)量精度,設(shè)計(jì)了一款TRL校準(zhǔn)工具,它可以扣除從SMA接頭到電容處對(duì)電容測(cè)試結(jié)果的影響。同時(shí),還利用LTCC工藝生產(chǎn)出不同尺寸的微波電容,對(duì)燒結(jié)和鍍金屬流程出現(xiàn)的問(wèn)題做出了改進(jìn),最后利用所設(shè)計(jì)的測(cè)試工具和校準(zhǔn)工具進(jìn)行準(zhǔn)確測(cè)試。
[Abstract]:As an important basic component in modern wireless communication system, capacitance determines the performance of the whole system. In practical circuits, capacitors are generally used in bypass and decoupling circuits. With the development trend of "integration and high speed" of communication system, the high frequency and miniaturization of capacitance have higher requirements. Therefore, the study of microwave capacitance is imperative. In this paper, the capacitance equivalent circuit model at high frequency is analyzed, and the relationship between the characteristic parameters (resonant frequency Q value) and physical size and bonding mode is studied, and the equivalent circuit parameters are extracted. Then the microwave capacitors with different sizes for high frequency circuits were produced by using low temperature co-fired ceramic process LTCC(Low Temperature Co-fired Ceramici, and the shortcomings of sintering and electrode plating in the process were improved at the same time. Finally, a calibration tool for measuring microwave capacitance is designed, which improves the accuracy of microwave capacitance measurement. The main contents of this paper are as follows: firstly, the design basis of microwave capacitance is introduced, and the basic concepts such as quality factor and effective capacity of capacitor are expounded, which lays a theoretical foundation for the establishment of equivalent circuit model, and then gives two different equivalent models. By analyzing the loss of the capacitor, it can be concluded that the loss of the capacitor increases with the increase of frequency. Therefore, increasing the resonant frequency of the capacitor is at the expense of its quality factor. Secondly, taking 0.5mm 脳 0.5mm 脳 0.2mm capacitor as an example, the physical model of capacitance with different connection modes is established in HFSS. The resonant frequency of capacitor current at the same end is higher than that at both ends. The capacitor is connected by gold wire bonding in actual circuit. Therefore, the microwave performance of gold wire itself is also analyzed, and the 蟺 type equivalent circuit using gold wire bonding capacitor is fitted. Finally, because of the high frequency of microwave capacitors, the parasitic parameters between the connectors and the capacitors have a great influence on the measurement results. Therefore, in order to improve the measurement accuracy, a TRL calibration tool is designed, which can deduct the influence of the SMA connector to the capacitance test results. At the same time, microwave capacitors of different sizes were produced by LTCC process, and the problems in sintering and metal plating were improved. Finally, the designed test tools and calibration tools were used for accurate testing.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2014
【分類(lèi)號(hào)】：TM53
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本文編號(hào)：1936216