【摘要】：正近日,中國科學院合肥物質科學研究院應用技術研究所先進材料中心研發(fā)團隊,在先進電子封裝材料研究方面取得系列進展。新型處理器的運行速度越來越快,高性能儀器的能耗在不斷增加,這迫使廉價的"輔助基板"或"依賴設備"要跟上發(fā)展的步伐,熱管理技術逐漸成為工程師們必須考慮的問題,對絕緣場合用作封裝和熱界面材料使用的高熱絕緣材料的需求越來越高。在半導體管與散熱器的封裝、管芯的保護、
[Abstract]:Recently, the research and development team of Advanced Materials Center of Institute of Applied Technology, Hefei Institute of material Science, Chinese Academy of Sciences, has made a series of progress in the research of advanced electronic packaging materials. The running speed of the new processor is getting faster and faster, and the energy consumption of high performance instruments is increasing, which forces the cheap "auxiliary substrate" or "dependent equipment" to keep up with the development. Thermal management technology has gradually become a problem that engineers must consider, and the demand for high thermal insulation materials used as packaging and thermal interface materials is getting higher and higher. In semiconductor tube and radiator packaging, tube core protection,
【分類號】：TM21
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本文編號：2501016