本文關(guān)鍵詞：有機(jī)基板表面覆膜接枝技術(shù)研究　出處：《電子科技大學(xué)》2016年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 有機(jī)基板 金屬化 預(yù)處理 接枝改性

【摘要】：有機(jī)聚合物材料表面金屬化后擁有導(dǎo)電、導(dǎo)熱、易成型等優(yōu)異性能,被廣泛應(yīng)用于生產(chǎn)與生活的各個方面。然而有機(jī)聚合物材料與其表面金屬覆蓋層之間的鍵合力較弱,研究有機(jī)聚合物材料表面金屬化的前處理技術(shù)和金屬化工藝就成為獲得性能優(yōu)良的表面金屬層的關(guān)鍵。本論文以柔性聚酰亞胺(PI)薄膜及剛性聚苯醚(PPE)板材作為基板,圍繞以上兩種有機(jī)基板表面改性及表面金屬化開展基礎(chǔ)研究工作。論文主要研究內(nèi)容如下:采用A堿溶液對PI薄膜進(jìn)行表面預(yù)處理,研究預(yù)處理對PI薄膜表面粗糙度、浸潤性以及官能團(tuán)的影響。結(jié)果表明,經(jīng)預(yù)處理后PI薄膜表面粗糙度增加,酰亞胺環(huán)結(jié)構(gòu)因水解反應(yīng)而打開,薄膜表面極性基團(tuán)增加,浸潤性提升。選取硫代硫酸鈉、硫氰化鉀以及硫脲為接枝單體對PI薄膜表面接枝改性,紅外光譜分析表明三種接枝單體均能與PI薄膜形成化學(xué)鍵合,實(shí)現(xiàn)對PI薄膜的接枝改性。以硫代硫酸鈉作為接枝單體,研究接枝率隨單體濃度、接枝時間以及接枝溫度的變化規(guī)律,獲得優(yōu)化的單體濃度為5 g/L,接枝時間為12 min,接枝溫度為60℃。采用M氧化劑溶液對PPE板進(jìn)行表面預(yù)處理,PPE板經(jīng)預(yù)處理后,主鏈苯環(huán)上的甲基被氧化為羧基,表面極性基團(tuán)增加,浸潤性明顯提升。采用氨丙基三乙氧基硅烷及巰丙基三乙氧基硅烷混合硅烷偶聯(lián)劑對PPE板進(jìn)行接枝改性,發(fā)現(xiàn)改性后基板S-H的伸縮振動峰、N-H的伸縮振動峰以及Si-O-H的伸縮振動峰強(qiáng)度均有所增強(qiáng),偶聯(lián)劑與PPE板形成化學(xué)鍵合。研究了固化時間及固化溫度對接枝率的影響,發(fā)現(xiàn)適宜的固化時間為15 min,固化溫度為50℃。通過化學(xué)鍍法實(shí)現(xiàn)PI薄膜及PPE板的表面金屬化。采用SEM、EDS及XRD對表面金屬層的形貌、成分以及結(jié)構(gòu)進(jìn)行分析,結(jié)果表明所制備金屬層均勻致密,可實(shí)現(xiàn)完整覆蓋,不含雜質(zhì)且結(jié)晶性好;對金屬層的導(dǎo)電性、熱穩(wěn)定性以及金屬層與基板間的結(jié)合性能進(jìn)行研究,結(jié)果表明所制備金屬層具有優(yōu)良的導(dǎo)電性及熱穩(wěn)定性;結(jié)合力測試表明,金屬層與PI薄膜間剝離強(qiáng)度達(dá)到6.0 N/cm,金屬層與PPE板間結(jié)合力可達(dá)5B級標(biāo)準(zhǔn)。
[Abstract]:After metallization, organic polymer materials have excellent properties such as conducting, heat conduction, easy forming and so on. It is widely used in all aspects of production and life. However, the bonding force between organic polymer materials and metal coatings on their surfaces is weak. The study of metallization technology and metallization technology on the surface of organic polymer materials has become the key to obtain the surface metal layer with good performance. In this paper, flexible polyimide (Pi) thin films and rigid polyphenylene ether (PPE) films were used. PPEs are used as substrates. The basic research work is carried out around the above two kinds of organic substrate surface modification and surface metallization. The main contents of this thesis are as follows: the surface pretreatment of Pi thin films with A alkali solution is carried out. The effects of pretreatment on the surface roughness, wettability and functional groups of Pi thin films were studied. The results showed that the surface roughness of Pi films was increased and the structure of imide ring was opened due to hydrolysis. The surface of Pi film was modified with sodium thiosulfate, potassium thiocyanate and thiourea as graft monomer. The IR spectra showed that all three kinds of grafted monomers could form chemical bonding with Pi films, and the grafting rate of Pi films was studied with sodium thiosulfate as graft monomer. The optimum monomer concentration was 5 g / L and grafting time was 12 min. The grafting temperature was 60 鈩，

本文編號：1382082