熔滲法制備結晶器銅板表面改性層的基礎研究
發(fā)布時間：2019-07-01 11:20
【摘要】：近來,連鑄結晶器銅板表面改性層的制備技術成為鋼鐵冶煉行業(yè)的研究熱點。連鑄結晶器銅板表面改性層的要求主要是具有高的耐磨性,及改性層與基體間有較好的傳熱性能和結合力。目前,國內外有關連鑄結晶器銅板表面改性層的制備技術主要有電鍍、化學鍍、熱噴涂和高溫自蔓延等,其中應用最為廣泛的是電鍍技術。這些表面改性技術,雖然在一定程度上提高了結晶器銅板表面的耐磨性,但是改性層的導熱率較低,并且改性層與銅基板的結合力不高。而W-Cu/WC-Cu復合材料,具有高硬度、耐磨性以及良好的導熱導電性能,并且可以調整銅含量達到與基體銅板之間形成較好的冶金結合。因此,我們將粉末冶金方法引進到結晶器銅板表面改性技術中,通過熔滲法制備W-Cu/WC-Cu改性層,為W-Cu/WC-Cu改性層在結晶器銅板上的實際應用,做好基礎研究。 本論文主要是從鎢骨架燒結溫度、鎢粉末粒度、熔滲方式三個方面來優(yōu)化W-Cu改性層的制備工藝,從骨架燒結溫度、熔滲溫度以及碳化鎢粉末粒度三個方面來優(yōu)化WC-Cu改性層的制備工藝。結果得出： (1)最佳的W-Cu40改性層制備工藝為：采用-300目W粉,1300℃保溫燒結鎢骨架,并在1350℃測滲,制備的改性層組織最均勻,且致密度高； (2)最佳的WC-Cu50改性層制備工藝：采用粒徑1μm的WC顆粒,1120℃燒結碳化鎢骨架,并在1350℃熔滲,制備的改性層組織均勻、致密度高。實驗還通過測量密度、摩擦磨損實驗、剪切實驗、熱疲勞實驗,檢測材料的致密度、耐磨性能、界面結合強度以及界面抗熱疲勞性能。摩擦實驗結果表明：(1)W-Cu合金改性層的耐磨性遠遠高于Ni；隨著W-Cu40改性層中W顆粒粒徑的增大,耐磨性降低；隨鎢含量增加,W-Cu合金改性層的耐磨性能提高； (2)制備的WC-Cu50改性層具優(yōu)異的耐磨性能,且隨著WC顆粒粒徑的減小,制備的改性層的耐磨性能提高。 剪切實驗結果表明：W-Cu40改性層與銅基板之間的結合較好,界面剪切時從基體銅端斷裂。 熱疲勞實驗結果表明：(1)W-Cu40改性層具有良好的抗熱疲勞性能。隨著W-Cu合金改性層中鎢含量的增加,經冷熱循環(huán)后產生的疲勞裂紋越寬；隨W-Cu合金改性層中W顆粒粒徑的增大,經冷熱循環(huán)后產生的疲勞裂紋可能性降低,產生裂紋的寬度也較窄；隨實驗溫度的提高,W-Cu合金改性層界面處裂紋普遍變寬；(2)不同粒徑的WC顆粒制備的WC-Cu50改性層經600℃水冷循環(huán)200次界面未發(fā)現裂紋,改性層具有較好的抗熱疲勞性能。
[Abstract]:Recently, the preparation technology of the surface modified layer of the copper plate of the continuous casting crystallizer has become the hot spot in the iron and steel smelting industry. The requirement of the surface modification layer of the copper plate of the continuous casting crystallizer is mainly to have high wear resistance and good heat transfer performance and binding force between the modified layer and the substrate. At present, the preparation technology of the surface modification layer of the copper plate of the continuous casting crystallizer at home and abroad is mainly electroplating, chemical plating, thermal spraying and high-temperature self-propagation. The surface modification technology improves the wear resistance of the surface of the crystallizer copper plate to a certain extent, but the thermal conductivity of the modified layer is low, and the bonding force between the modified layer and the copper substrate is not high. And the W-Cu/ WC-Cu composite material has high hardness, wear resistance and good thermal conductivity, and can adjust the copper content to form a good metallurgical bond with the base copper plate. Therefore, we introduced the powder metallurgy method to the surface modification technology of the crystallizer copper plate, and the W-Cu/ WC-Cu modified layer was prepared by the infiltration method, and the W-Cu/ WC-Cu modified layer was applied to the crystallizer copper plate, and the basic research was made. The preparation technology of W-Cu modified layer was optimized from three aspects of the sintering temperature of the tungsten skeleton, the particle size of the tungsten powder and the infiltration mode, and the preparation of the WC-Cu modified layer was optimized from three aspects of the sintering temperature, the infiltration temperature and the particle size of the tungsten carbide powder. Process. Results The preparation method of (1) the optimal W-Cu40 modified layer comprises the following steps of: (1) preparing the W-Cu40 modified layer by using -300-mesh W powder and 1300 DEG C for sintering the tungsten skeleton, and measuring the permeability at the temperature of 1350 DEG C, so that the prepared modified layer structure is the most uniform; and (2) the best WC-Cu5 The preparation process of the 0 modified layer comprises the following steps of: adopting WC particles with a particle size of 1 & mu; m, sintering the tungsten carbide framework at 1120 & deg; C, and fusing at 1350 & deg; C to prepare the modified layer group; In that experiment, the density, the friction and wear experiment, the shear test, the thermal fatigue experiment, the density of the test material, the wear resistance, the bond strength of the interface and the strength of the interface are also measured by the experiment. The results of the friction experiments show that (1) the wear resistance of the W-Cu alloy modified layer is much higher than that of Ni; with the increase of the particle size of W particles in the W-Cu40 modified layer, the wear resistance is decreased; and the W-Cu alloy is modified with the increase of the tungsten content. The wear resistance of the layer is improved; (2) the prepared WC-Cu50 The modified layer has excellent wear resistance and is prepared with the reduction of the particle size of the WC particles. The results of the shear test show that the bonding between W-Cu40 modified layer and copper substrate is higher. The results of thermal fatigue test show that: (1) W-C The modified layer of the W-Cu alloy has good thermal fatigue resistance. With the increase of the tungsten content in the W-Cu alloy modified layer, the wider the fatigue crack generated after the cold and hot cycle, the possibility of the fatigue crack generated after the cold and hot circulation is reduced with the increase of the particle size of the W particles in the W-Cu alloy modified layer, The width of the crack is also narrow; with the increase of the experimental temperature, the crack in the interface of the W-Cu alloy modified layer is generally widened; (2) the WC-Cu50 modified layer prepared by the WC particles with different grain diameters is not found through the 200-time interface of the water-cooling cycle of 600 DEG C
【學位授予單位】：大連理工大學
【學位級別】：碩士
【學位授予年份】：2011
【分類號】：TF341.6
本文編號：2508429
[Abstract]:Recently, the preparation technology of the surface modified layer of the copper plate of the continuous casting crystallizer has become the hot spot in the iron and steel smelting industry. The requirement of the surface modification layer of the copper plate of the continuous casting crystallizer is mainly to have high wear resistance and good heat transfer performance and binding force between the modified layer and the substrate. At present, the preparation technology of the surface modification layer of the copper plate of the continuous casting crystallizer at home and abroad is mainly electroplating, chemical plating, thermal spraying and high-temperature self-propagation. The surface modification technology improves the wear resistance of the surface of the crystallizer copper plate to a certain extent, but the thermal conductivity of the modified layer is low, and the bonding force between the modified layer and the copper substrate is not high. And the W-Cu/ WC-Cu composite material has high hardness, wear resistance and good thermal conductivity, and can adjust the copper content to form a good metallurgical bond with the base copper plate. Therefore, we introduced the powder metallurgy method to the surface modification technology of the crystallizer copper plate, and the W-Cu/ WC-Cu modified layer was prepared by the infiltration method, and the W-Cu/ WC-Cu modified layer was applied to the crystallizer copper plate, and the basic research was made. The preparation technology of W-Cu modified layer was optimized from three aspects of the sintering temperature of the tungsten skeleton, the particle size of the tungsten powder and the infiltration mode, and the preparation of the WC-Cu modified layer was optimized from three aspects of the sintering temperature, the infiltration temperature and the particle size of the tungsten carbide powder. Process. Results The preparation method of (1) the optimal W-Cu40 modified layer comprises the following steps of: (1) preparing the W-Cu40 modified layer by using -300-mesh W powder and 1300 DEG C for sintering the tungsten skeleton, and measuring the permeability at the temperature of 1350 DEG C, so that the prepared modified layer structure is the most uniform; and (2) the best WC-Cu5 The preparation process of the 0 modified layer comprises the following steps of: adopting WC particles with a particle size of 1 & mu; m, sintering the tungsten carbide framework at 1120 & deg; C, and fusing at 1350 & deg; C to prepare the modified layer group; In that experiment, the density, the friction and wear experiment, the shear test, the thermal fatigue experiment, the density of the test material, the wear resistance, the bond strength of the interface and the strength of the interface are also measured by the experiment. The results of the friction experiments show that (1) the wear resistance of the W-Cu alloy modified layer is much higher than that of Ni; with the increase of the particle size of W particles in the W-Cu40 modified layer, the wear resistance is decreased; and the W-Cu alloy is modified with the increase of the tungsten content. The wear resistance of the layer is improved; (2) the prepared WC-Cu50 The modified layer has excellent wear resistance and is prepared with the reduction of the particle size of the WC particles. The results of the shear test show that the bonding between W-Cu40 modified layer and copper substrate is higher. The results of thermal fatigue test show that: (1) W-C The modified layer of the W-Cu alloy has good thermal fatigue resistance. With the increase of the tungsten content in the W-Cu alloy modified layer, the wider the fatigue crack generated after the cold and hot cycle, the possibility of the fatigue crack generated after the cold and hot circulation is reduced with the increase of the particle size of the W particles in the W-Cu alloy modified layer, The width of the crack is also narrow; with the increase of the experimental temperature, the crack in the interface of the W-Cu alloy modified layer is generally widened; (2) the WC-Cu50 modified layer prepared by the WC particles with different grain diameters is not found through the 200-time interface of the water-cooling cycle of 600 DEG C
【學位授予單位】：大連理工大學
【學位級別】：碩士
【學位授予年份】：2011
【分類號】：TF341.6
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