【摘要】：本文設計了一種可用于通信機柜的半導體冷卻裝置,搭建了測試平臺測試分析了散熱量及冷卻效率。根據測試結果分析了該半導體冷卻裝置在空氣冷卻工況下的散熱量、冷卻效率及影響因素,得到性能評價參數。結果表明:當環(huán)境平均溫度為26℃且輸入功率在200~360 W范圍內時,裝置的冷卻效率先增大后減小,在輸入功率為232 W時冷卻效率達到最大值69.5%,制冷小室平均散熱量為455.45 kJ,半導體冷卻裝置的冷卻功率為151.8 W,且在相同條件下該裝置可以帶走5 kW通信機柜3.04%的熱量。
[Abstract]:In this paper, a kind of semiconductor cooling device can be used in communication cabinet is designed, and the test platform is set up to test and analyze the heat dissipation and cooling efficiency. According to the test results, the heat dissipation, cooling efficiency and influencing factors of the semiconductor cooling device under the air cooling condition are analyzed, and the performance evaluation parameters are obtained. The results show that when the average ambient temperature is 26 鈩，

本文編號：2213891