【摘要】：隨著4G通信時(shí)代的到來(lái)以及5G通信的提出,移動(dòng)通信技術(shù)以及移動(dòng)通信設(shè)備發(fā)生著翻天覆地的變化。移動(dòng)通信的信號(hào)傳輸頻率與傳輸速率的不斷的提高,要求移動(dòng)通信印制電路板中的精細(xì)線路具有規(guī)整的形狀以及平滑的表面;移動(dòng)通信設(shè)備體積的不斷減小以及IC半導(dǎo)體器件I/O接口的增多要求印制電路板中精細(xì)線路的密度越來(lái)越高。本文首先研究了減成法制作工藝對(duì)蝕刻參數(shù)進(jìn)行了優(yōu)化,以蝕刻因子和側(cè)蝕量作為實(shí)驗(yàn)指標(biāo),抗蝕層厚度,線路銅層的厚度,蝕刻液的噴淋壓力作為實(shí)驗(yàn)因素進(jìn)行正交實(shí)驗(yàn)對(duì)蝕刻因素進(jìn)行優(yōu)化,獲得了減成法蝕刻過程中的最佳參數(shù)。在最佳參數(shù)下,最大的蝕刻因子為4.90,最小的側(cè)蝕量為1.98μm。這一結(jié)果能夠滿足4G移動(dòng)通信印制電路板的需求,然而隨著5G通信的到來(lái),移動(dòng)通信印制電路板的精細(xì)線路發(fā)展到35μm以下,減成法不能滿足這樣精細(xì)的線路制作要求,新的精細(xì)線路制作方法成為移動(dòng)通信發(fā)展的必然。通過比較,半加成法是移動(dòng)通信印制電路高密度精細(xì)線路的理想制作方法。針對(duì)半加成法種子層基材結(jié)合力不好或者沉積成本太貴的缺點(diǎn),本文提出了以鎳作為種子層的新型半加成法�；瘜W(xué)鍍鎳的沉積速率影響生產(chǎn)效率,本文采用單因素實(shí)驗(yàn)優(yōu)化了化學(xué)鍍鎳的沉積速率,得到最優(yōu)的參數(shù)為:活化時(shí)間15分鐘,主鹽的濃度為25g/L,還原劑的濃度為35g/L,鍍液pH值為8.5,施鍍溫度為85℃。選擇型號(hào)為SZ-1235的杜邦干膜作為抗電鍍干膜;選取電流密度為0.8A/dm2,電鍍時(shí)間為120分鐘;選擇厚度為2μm的化學(xué)鎳層作為種子層,快速蝕刻時(shí)間選擇為2分鐘。在鎳層上制作精細(xì)線路后用金相顯微鏡、掃描電子顯微鏡、剝離強(qiáng)度測(cè)試檢測(cè)了精細(xì)線路的結(jié)果。檢測(cè)發(fā)現(xiàn),線路的表面和側(cè)面平整光潔,線路層與基材之間結(jié)合緊密,線路截面形狀非常規(guī)整,計(jì)算線路的蝕刻因子,各組精細(xì)線路的蝕刻因子基本能達(dá)到8以上。精細(xì)線路的剝離強(qiáng)度測(cè)試結(jié)果都滿足IPC(Institute of Printed Circuits,印制電路協(xié)會(huì))的品質(zhì)要求。對(duì)比減成法和普通半加成法,本實(shí)驗(yàn)制作的精細(xì)線路蝕刻因子更高,線路截面形狀比普通半加成法更加規(guī)整,顯然更加適合與移動(dòng)通信印制電路板的生產(chǎn)。
[Abstract]:With the coming of 4G communication era and the proposal of 5G communication, mobile communication technology and mobile communication equipment are changing dramatically. The continuous improvement of the signal transmission frequency and transmission rate of mobile communication requires that the fine lines in the printed circuit board of mobile communication have regular shape and smooth surface. With the decrease of the volume of mobile communication devices and the increase of I / O interface of IC semiconductor devices, the density of fine circuits in printed circuit boards (PCB) is getting higher and higher. In this paper, the etching parameters are optimized by subtraction method. Etch factor and side etching amount are taken as the experimental indexes, the thickness of corrosion resistance layer and the thickness of copper layer on line are studied. The spray pressure of the etching solution was used as the experimental factor to optimize the etch factors and the optimum parameters in the process of subtraction etching were obtained. Under the optimum parameters, the maximum etching factor is 4.90 and the minimum side etching amount is 1.98 渭 m. This result can satisfy the demand of 4G mobile communication printed circuit board. However, with the arrival of 5G communication, the fine circuit line of mobile communication printed circuit board develops below 35 渭 m. The new fine line manufacturing method is inevitable for the development of mobile communication. By comparison, the semi-addition method is an ideal method for manufacturing high density fine circuit of printed circuit of mobile communication. A new semi-addition method with nickel as seed layer is proposed in this paper to overcome the disadvantage of poor adhesion or expensive deposition cost of seed layer by semi-addition method. The deposition rate of electroless nickel plating affects the production efficiency. In this paper, the deposition rate of electroless nickel plating is optimized by single factor experiment. The optimum parameters are as follows: activation time 15 minutes. The concentration of main salt is 25g / L, the concentration of reductant is 35g / L, the pH value of bath is 8.5, and the plating temperature is 85 鈩，

本文編號(hào)：2126486