【摘要】：隨著半導(dǎo)體激光器輸出功率的進(jìn)一步提高,熱管理已經(jīng)成為制約其性能和可靠性的關(guān)鍵瓶頸之一。利用有限元方法對(duì)千瓦級(jí)高功率傳導(dǎo)冷卻型(G-Stack)半導(dǎo)體激光器陣列的熱特性進(jìn)行數(shù)值模擬與分析。結(jié)果表明工作脈寬大于250μs時(shí)器件各發(fā)光單元之間會(huì)發(fā)生嚴(yán)重的熱串?dāng)_現(xiàn)象。在橫向及垂直方向的熱量分別為64.7%與35.3%,橫向方向熱阻的74.9%及垂直方向熱阻的66.5%來(lái)自CuW,表明CuW對(duì)于激光器的散熱性能有著決定性的影響。實(shí)驗(yàn)測(cè)試了器件在不同占空比條件下的光譜特性,得到工作頻率分別為20、30、40 Hz相對(duì)50 Hz的溫差分別為2.33、1.56、0.78℃,根據(jù)累積平均溫度法計(jì)算得到的溫差分別為2.13,1.47,0.75℃,理論模擬結(jié)果相對(duì)于實(shí)驗(yàn)結(jié)果的平均誤差小于6.85%,結(jié)果表明理論模擬結(jié)果和實(shí)驗(yàn)瞬態(tài)熱阻基本吻合。
[Abstract]:With the further improvement of the output power of semiconductor lasers, thermal management has become one of the key bottlenecks restricting the performance and reliability of semiconductor lasers. The thermal characteristics of a kilowatt high power conducting cooling (G-Stack) semiconductor laser array are numerically simulated and analyzed by finite element method (FEM). The results show that when the working pulse width is larger than 250 渭 s, serious thermal crosstalk will occur among the various luminescent cells. The heat in the transverse and vertical directions is 64.7% and 35.3.The thermal resistance in the transverse direction is 74.9% and the thermal resistance in the vertical direction is 66.5% from CuW,. The results show that CuW has a decisive effect on the heat dissipation performance of the laser. The spectral characteristics of the device under different duty cycle conditions have been experimentally tested. The temperature difference of the operating frequency of 20 ~ 30 ~ 40 Hz to 50 Hz is 2.33 ~ 1.56 ~ 0.78 鈩，

本文編號(hào)：2284007