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陶瓷基片外觀檢測(cè)及分揀系統(tǒng)設(shè)計(jì)

發(fā)布時(shí)間:2019-03-06 21:01
【摘要】:在電阻及電容的組成材料中,陶瓷基片的尺寸和表面光滑度都決定著電阻的阻值和電容的容量,同時(shí)隨著電子產(chǎn)業(yè)的發(fā)展,電阻、電容要求制作的越來(lái)越小,使得對(duì)陶瓷基片的檢測(cè)有更高的要求。目前市面上對(duì)陶瓷基片的檢測(cè)都是用視覺(jué)處理來(lái)克服人工檢測(cè)的缺陷,但大多數(shù)方法都是直接利用像素坐標(biāo)進(jìn)行參數(shù)計(jì)算,需要系統(tǒng)進(jìn)行龐大的數(shù)據(jù)計(jì)算,并要通過(guò)硬件的精密配合來(lái)完成圖像的采集。本文在此基礎(chǔ)上做了改進(jìn),設(shè)計(jì)了陶瓷基片檢測(cè)器用來(lái)對(duì)陶瓷基片的表面光滑度、基片外形尺寸進(jìn)行檢測(cè),以及對(duì)矩形基片的垂直度檢測(cè);設(shè)計(jì)了結(jié)合檢測(cè)結(jié)果對(duì)產(chǎn)品進(jìn)行自動(dòng)分揀的分揀機(jī)構(gòu)。具體工作內(nèi)容如下:(1)分析了基片的常見(jiàn)缺陷和尺寸大小,根據(jù)缺陷特征參數(shù)對(duì)基片是否含有缺陷進(jìn)行判斷、分類,完成檢測(cè)器的檢測(cè)任務(wù)。系統(tǒng)中采用了穩(wěn)定性好、傳輸效率高的PPI通信協(xié)議,將嵌入式系統(tǒng)得出的檢測(cè)結(jié)果傳送至PLC,并通過(guò)對(duì)伺服電機(jī)的控制完成自動(dòng)分揀功能,完成分揀機(jī)構(gòu)設(shè)計(jì)。最后,利用miniGUI來(lái)制作人機(jī)界面,完成整個(gè)過(guò)程的人機(jī)交互功能。(2)在基片檢測(cè)過(guò)程中,系統(tǒng)中為了克服傳統(tǒng)的缺陷參數(shù)計(jì)算過(guò)程中出現(xiàn)的誤差,先采用像素坐標(biāo)計(jì)算的方法,得出計(jì)算結(jié)果一;然后求出基片重心,以及離重心最遠(yuǎn)點(diǎn)和最近點(diǎn)的距離,來(lái)計(jì)算相關(guān)參數(shù),得出計(jì)算結(jié)果二;最后,將二者作分析比較,得出最終計(jì)算參數(shù),并設(shè)計(jì)參數(shù)計(jì)算程序。(3)系統(tǒng)在嵌入式平臺(tái)上,利用實(shí)時(shí)圖像采集程序和圖像處理程序得到單像素寬度的基片邊緣圖像。并使用亞像素算法得到供參數(shù)計(jì)算使用的亞像素邊緣坐標(biāo)。(4)在實(shí)驗(yàn)室現(xiàn)有的實(shí)驗(yàn)條件下,搭建了系統(tǒng)的實(shí)驗(yàn)平臺(tái),對(duì)系統(tǒng)的各控制部分分別進(jìn)行了實(shí)驗(yàn)驗(yàn)證。通過(guò)實(shí)驗(yàn)結(jié)果發(fā)現(xiàn),系統(tǒng)的各個(gè)部分都能夠在相關(guān)程序的指引下完成相對(duì)應(yīng)的系統(tǒng)功能,并且驗(yàn)證了系統(tǒng)的設(shè)計(jì)可以在規(guī)定的時(shí)間及誤差范圍內(nèi)完成陶瓷基片的各項(xiàng)檢測(cè)及分揀功能,具有低功耗、低成本、安裝方便、精度高、實(shí)時(shí)性好等特點(diǎn),并能夠克服傳統(tǒng)檢測(cè)的諸多缺點(diǎn)。
[Abstract]:In the composition materials of resistance and capacitance, the size and surface smoothness of ceramic substrate determine the resistance value and capacitance capacity. At the same time, with the development of electronic industry, the requirement of fabrication of resistance and capacitance becomes smaller and smaller. It makes the detection of ceramic substrate have higher requirements. At present, the detection of ceramic substrates on the market is to overcome the defects of manual inspection by visual processing, but most methods use pixel coordinates directly to calculate parameters, which requires a large amount of data calculation in the system. And through the precise cooperation of the hardware to complete the image acquisition. In this paper, the ceramic substrate detector is designed to detect the smooth surface of ceramic substrate, the size of the substrate, and the verticality of the rectangular substrate, on the basis of this, the ceramic substrate detector is designed to detect the smoothness of the surface of the ceramic substrate and the dimension of the substrate. A sorting mechanism for automatic sorting of products is designed based on the testing results. The main contents are as follows: (1) the common defects and the size of the substrate are analyzed, and the defects in the substrate are judged and classified according to the defect characteristic parameters, and the detection task of the detector is completed. The PPI communication protocol, which has good stability and high transmission efficiency, is adopted in the system. The test results obtained from the embedded system are transmitted to the PLC, and the automatic sorting function is completed through the control of the servo motor, and the sorting mechanism is designed. Finally, using miniGUI to make man-machine interface to complete the whole process of human-computer interaction. (2) in the process of substrate detection, the system in order to overcome the traditional error in the calculation of defect parameters, Firstly, the method of pixel coordinate calculation is used to get the first result. Then the center of gravity of the substrate and the distance from the farthest point and the nearest point of the center of gravity are calculated to calculate the related parameters and get the result of calculation. Finally, the final calculation parameters are obtained by comparing them. (3) on the embedded platform, the real-time image acquisition program and the image processing program are used to obtain the single pixel width image of the substrate edge. (3) the system uses the real-time image acquisition program and the image processing program to obtain the single pixel width substrate edge image. The sub-pixel edge coordinates for parameter calculation are obtained by using the sub-pixel algorithm. (4) under the existing experimental conditions in the laboratory, the experimental platform of the system is built, and the control parts of the system are verified by experiments. The experimental results show that each part of the system can complete the corresponding system functions under the guidance of the relevant procedures. And verified that the design of the system can complete the detection and sorting functions of ceramic substrates within the specified time and error range, with the characteristics of low power consumption, low cost, convenient installation, high precision and good real-time performance, and so on. It can overcome many shortcomings of traditional detection.
【學(xué)位授予單位】:太原科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2016
【分類號(hào)】:TQ174.6;TP391.41

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