本文關(guān)鍵詞： 指紋識(shí)別 低溫錫膏 噴涂工藝 焊盤設(shè)計(jì) 可靠性　出處：《南昌航空大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：指紋本身的唯一性和不變性,使得指紋識(shí)別技術(shù)在身份辨識(shí)系統(tǒng)中安全性能比傳統(tǒng)上的基于密碼的身份識(shí)別方式有了很大改進(jìn),越來越吸引企業(yè)和機(jī)構(gòu)對(duì)其進(jìn)行研究,目前也廣泛被應(yīng)用在民用產(chǎn)品中,如指紋鎖、考勤機(jī)、手機(jī)和車載設(shè)備等。但是,由于指紋模組制作工藝較復(fù)雜,工藝冗長(zhǎng),設(shè)計(jì)上不成熟等問題的存在,研究如何改進(jìn)指紋模組制作工藝及提升效率是指紋模組制作工藝的關(guān)鍵。本文就現(xiàn)有指紋模組制造工藝過程存在的表面刮傷、邊緣積油等噴涂工序產(chǎn)品不良比例高、夾具種類繁多且上下料效率低、工藝流程繁瑣、可靠性,組裝間隙等方面問題,對(duì)模組制作工藝中使用到的錫膏性能和芯片焊盤結(jié)構(gòu)設(shè)計(jì)以及組裝工藝三方面進(jìn)行分析并加以改進(jìn),在一定程度上改善了指紋模組的產(chǎn)品質(zhì)量和制作效率,具體研究?jī)?nèi)容如下概述:(1)通過分析低溫錫膏的性能,引入低溫錫膏材料代替高溫錫膏,實(shí)現(xiàn)了整版芯片先噴涂后焊接的可能,將原來需切割為單顆芯片后噴涂的方式改為直接整版芯片噴涂后切割,并對(duì)此改進(jìn)了噴涂夾具的設(shè)計(jì),該方式不僅簡(jiǎn)化了指紋識(shí)別模組制作工藝流程,而且解決了原有工藝的噴涂品質(zhì)問題,并大大減少了噴涂工序中時(shí)間的消耗,顯著的提升了制作效率,降低了噴涂夾具的使用數(shù)量。(2)由于低溫錫膏相對(duì)原來工藝使用的高溫錫膏,在焊接強(qiáng)度方面顯得弱些,因而使用低溫錫膏的產(chǎn)品可靠性方面可能存在很大的隱患。針對(duì)此問題,本文通過深入研究芯片焊盤的設(shè)計(jì)結(jié)構(gòu),進(jìn)一步改進(jìn)芯片焊盤結(jié)構(gòu)設(shè)計(jì),進(jìn)而達(dá)到改善膠水的填充效果增強(qiáng)了焊接強(qiáng)度。并通過振動(dòng)、落球和跌落等可靠性試驗(yàn)證實(shí)了優(yōu)化后的焊盤結(jié)構(gòu)設(shè)計(jì)能有效彌補(bǔ)低溫錫膏焊接強(qiáng)度弱的缺陷,達(dá)到了所規(guī)定的相關(guān)可靠性標(biāo)準(zhǔn)。(3)針對(duì)指紋識(shí)別制作外觀組裝間隙不良問題,比如金屬環(huán)和芯片間隙的存在。本文對(duì)此問題進(jìn)行了研究,通過改變指紋制作工藝的部分流程,即讓上蓋金屬環(huán)與芯片先組合再和FPC軟板綁定,在一定程度上優(yōu)化了間隙的問題。
[Abstract]:Due to the uniqueness and invariance of fingerprint, the security performance of fingerprint identification technology in identity identification system is much improved than that of traditional cipher based identification method. It attracts more and more enterprises and institutions to research, and is also widely used in civilian products, such as fingerprint locks, attendance machines, mobile phones and vehicle-mounted equipment. However, because of the fingerprint module manufacturing process is more complex. The process is long, the design is not mature and so on the existence of problems. How to improve the manufacturing process of fingerprint module and how to improve the efficiency is the key to the manufacturing process of fingerprint module. There are many problems in spraying process such as edge oil, such as bad proportion of products, various kinds of jigs and low efficiency of loading and unloading, complicated technological process, reliability, assembly clearance and so on. The properties of tin paste, chip pad structure design and assembly process were analyzed and improved. To some extent, the product quality and manufacturing efficiency of fingerprint module were improved. By analyzing the properties of low temperature tin paste and introducing low temperature tin paste instead of high temperature tin paste, the possibility of first spraying and welding the whole plate chip is realized. The original need to cut into a single chip after spraying instead of a direct chip after spraying cutting, and to improve the spray fixture design, this method not only simplifies the fingerprint identification module manufacturing process. Moreover, it solves the problem of spraying quality of the original process, and greatly reduces the consumption of time in the spraying process, and improves the production efficiency significantly. The quantity of spraying fixture is reduced. (2) because the low temperature tin paste is weaker than the high temperature tin paste used in the original process, the welding strength is weaker. Therefore, there may be great hidden trouble in the reliability of the products using low temperature tin paste. In view of this problem, this paper further improves the chip pad structure design through the in-depth study of chip pad design structure. Through reliability tests such as vibration, ball drop and drop, it is proved that the optimized pad structure design can effectively compensate the defects of low temperature solder paste welding strength. Meet the relevant reliability standard. 3) for fingerprint identification manufacturing appearance assembly gap problem, such as metal ring and chip gap exists. This paper studies this problem. By changing part of the process of fingerprint fabrication, that is, the metal ring of the upper cover is combined with the chip first and then bound to the FPC soft plate, the gap problem is optimized to a certain extent.
【學(xué)位授予單位】：南昌航空大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TP391.41

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