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硅對(duì)熱浸鍍ZnAl4合金鍍層組織及生長(zhǎng)動(dòng)力學(xué)的影響

發(fā)布時(shí)間:2018-09-11 05:47
【摘要】:采用熱浸鍍法在純鐵片表面制備鋅鋁合金鍍層,研究純鐵片在鋅鋁熔池(ZnAl4)中的界面反應(yīng),分析熔池中添加硅元素對(duì)鍍層組織與生長(zhǎng)動(dòng)力學(xué)的影響。結(jié)果表明:隨熱鍍時(shí)間延長(zhǎng),鋅鋁凝固組織與基體間的金屬間化合物層(即中間合金層)的厚度增加。熔池中加入0.15%Si時(shí),鐵鋁金屬間化合物層的生長(zhǎng)受到抑制,厚度減小,特別是在600℃時(shí)厚度減小更明顯。Si在金屬間化合物層中富集,使Fe和Al原子通過液相通道相互擴(kuò)散受到阻礙,鐵鋁抑制層穩(wěn)定存在,從而降低金屬間化合物層的厚度。熔池中硅含量增加至0.30%時(shí),對(duì)于鐵鋅合金層的抑制作用消失,合金層結(jié)構(gòu)與不含硅時(shí)相似,形成Fe_2Al_5/FeAl_3/(Zn-Al)液相凝固組織。中間合金層的厚度隨時(shí)間延長(zhǎng)呈拋物線增長(zhǎng),表明鍍層的形成受擴(kuò)散控制;但適量硅在中間合金層的溶解能阻礙鐵鋅原子的擴(kuò)散,從而抑制鍍層過度生長(zhǎng)。
[Abstract]:Zn-Al alloy coating was prepared on the surface of pure iron by hot dip plating. The interface reaction of pure iron in ZnAl4 was studied. The effect of silicon addition on the microstructure and growth kinetics of the coating was analyzed. The results show that the thickness of intermetallic compound layer (i.e. master alloy layer) between solidified structure and substrate increases with the increase of hot plating time. With the addition of 0.15%Si in the molten pool, the growth of the Fe-Al intermetallic compound layer was inhibited, and the thickness decreased, especially at 600 鈩,

本文編號(hào):2235713

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