發(fā)布時間：2018-01-27 23:39

  本文關(guān)鍵詞： 雙輥法 金錫焊料 均勻化退火　出處：《中南大學學報(自然科學版)》2015年11期 　論文類型：期刊論文

【摘要】：采用雙輥甩帶技術(shù)制備Au-20%Sn焊料薄帶材,觀察和分析快速凝固Au-20%Sn焊料薄帶的顯微組織以及熔融特性,并研究合金的均勻化退火工藝。研究結(jié)果表明:雙輥甩帶合金由ζ′(An5Sn)和δ(Au Sn)兩相組成,顯微組織細小。合金的熔化溫度接近共晶點,滿足焊料的熔點要求。均勻化退火過程中,δ(Au Sn)相逐漸長大,合金的硬度降低。根據(jù)薄帶的組織和硬度,確定均勻化退火工藝為260℃下退火4 h。
[Abstract]:The Au-20%Sn solder thin strip was prepared by double roll strip casting technique. The microstructure and melting characteristics of the rapid solidification Au-20%Sn solder strip were observed and analyzed. The homogenization annealing process of the alloy is also studied. The results show that the double roll zipper alloy consists of Zeta (An5SnN) and 未 -Au (Sn2) phases. The microstructure is fine. The melting temperature of the alloy is close to the eutectic point, which meets the melting point requirement of solder. According to the microstructure and hardness of the strip, the homogenization annealing process was determined to be annealed at 260 鈩，

本文編號：1469145