【摘要】：化學(xué)機(jī)械拋光作為一種具有獨(dú)特優(yōu)勢的加工工藝手段,在微電子領(lǐng)域以及光學(xué)加工領(lǐng)域已經(jīng)有著十分廣泛的應(yīng)用。化學(xué)機(jī)械拋光中,拋光液作為提供化學(xué)反應(yīng)物質(zhì),排除加工碎屑的加工介質(zhì),在工藝中占有重要地位。拋光液的流動(dòng)過程能夠?qū)伖馑璧幕瘜W(xué)物質(zhì)以及磨料輸送至拋光墊表面、帶走摩擦生成的熱量以及加工產(chǎn)物,維持穩(wěn)定的拋光加工環(huán)境,同時(shí),拋光液在流動(dòng)中能夠在工件與拋光墊之間建立具有承載力的潤滑薄膜,改善工件與拋光墊的接觸狀態(tài)。為了能夠弄清化學(xué)機(jī)械拋光加工中拋光液流動(dòng)規(guī)律,研究拋光墊表面形貌對拋光液流動(dòng)的影響,優(yōu)化拋光墊表面形貌來控制拋光液的流動(dòng),本文開展了以下研究:1.平整的無溝槽拋光墊表面拋光液流動(dòng)狀態(tài)分析。使用流體力學(xué)方程推導(dǎo)拋光液在無粘性假設(shè)下的流動(dòng)狀態(tài),使用有限元法對拋光液流動(dòng)行為進(jìn)行的仿真結(jié)果顯示,拋光液由于由內(nèi)而外的加速運(yùn)動(dòng)趨勢以及增大的濕周長度,液面高度呈現(xiàn)明顯下降,流動(dòng)均勻性差。使用粒子圖像測速實(shí)驗(yàn)驗(yàn)證了仿真結(jié)果。2.結(jié)合多相流模型的有限元仿真和粒子圖像測速實(shí)驗(yàn),探索了具有溝槽的拋光墊表面拋光液的流動(dòng)特性。拋光液在拋光墊溝槽中流動(dòng),受到明顯的阻擋作用,拋光液流動(dòng)的沿程能量損失顯著,相比于平整無溝槽拋光墊表面的情況,具有溝槽的拋光墊表面流動(dòng)具有更高的液膜厚度,不易導(dǎo)致碎屑的沉降,有利于高效排出碎屑;拋光液從內(nèi)而外的徑向流動(dòng)速度變動(dòng)也得到了一定程度的改善。對多種不同溝槽網(wǎng)格形狀的拋光墊中流動(dòng)狀態(tài)進(jìn)行了比較和討論,結(jié)果顯示網(wǎng)格形狀為正六邊形時(shí),拋光液流動(dòng)的均勻性最佳。3.拋光墊表面溝槽優(yōu)化設(shè)計(jì)。在對拋光液流動(dòng)沿程能量損失的理論下,對拋光墊表面溝槽進(jìn)行了優(yōu)化設(shè)計(jì),優(yōu)化涉及溝槽寬深比、溝槽尺寸以及溝槽沿拋光墊表面的分布走向。使用有限元仿真手段對優(yōu)化的溝槽中拋光液流動(dòng)狀態(tài)進(jìn)行了分析,結(jié)果顯示其流動(dòng)徑向速度均勻,且具有一致的液面高度,實(shí)驗(yàn)結(jié)果也顯示溝槽中徑向流速均勻一致,達(dá)到了預(yù)期的優(yōu)化效果。
[Abstract]:Chemical mechanical polishing (CMA) has been widely used in the field of microelectronics and optical processing as a kind of processing technology with unique advantages. Polishing fluid plays an important role in the process of chemical mechanical polishing. The flow process of the polishing liquid can transport the chemicals and abrasives needed for polishing to the surface of the polishing pad, take away the heat generated by friction and the processing products, and maintain a stable polishing environment, at the same time, The lubricating film with bearing capacity can be established between the workpiece and the polishing pad during the flow of the polishing liquid, and the contact state between the workpiece and the polishing pad can be improved. In order to make clear the flow rule of polishing fluid in chemical mechanical polishing process, to study the effect of polishing pad surface morphology on polishing liquid flow, and to optimize the surface morphology of polishing pad to control the flow of polishing liquid, the following researches have been carried out in this paper: 1. Surface polishing fluid flow analysis of smooth grooveless polishing pad. The fluid dynamics equation is used to deduce the flow state of the polishing fluid under the assumption of non-viscosity. The simulation results of the flow behavior of the polishing liquid by using the finite element method show that the polishing fluid is due to the tendency of acceleration from inside to outside and the increase of the wet cycle length. The height of liquid level decreased obviously and the flow uniformity was poor. The experimental results of particle image velocimetry are used to verify the simulation results. 2. Based on the finite element simulation of multiphase flow model and particle image velocimetry experiment, the flow characteristics of polishing fluid on the surface of polishing pad with grooves are investigated. The flow of polishing fluid in the grooves of the polishing pad is obviously blocked, and the energy loss along the course of the flow of the polishing fluid is significant. Compared with the case of leveling the surface of the polishing pad without grooves, the surface flow of the polishing pad with grooves has a higher liquid film thickness. It is not easy to cause detritus sedimentation, which is beneficial to the removal of detritus efficiently. The variation of radial velocity of polishing fluid from inside to out has also been improved to some extent. The flow state of polishing pad with different groove mesh shapes is compared and discussed. The results show that the uniform flow of polishing fluid is the best when the mesh shape is hexagonal. 3. Surface groove optimization design of polishing pad. Based on the theory of energy loss along the polishing fluid flow, the groove on the surface of the polishing pad is optimized, which involves the ratio of width to depth, the size of the groove and the distribution of the groove along the surface of the polishing pad. The flow state of polished liquid in the optimized grooves is analyzed by finite element simulation. The results show that the radial velocity is uniform and the liquid level is uniform. The experimental results also show that the radial velocity in the grooves is uniform and consistent. The desired optimization effect is achieved.
【學(xué)位授予單位】：南京航空航天大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TG175

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本文編號(hào)：2338338