【摘要】：研究了6061Al鋁合金和AZ31B鎂合金的攪拌摩擦搭接焊(FSLW)接頭微觀組織及焊后熱處理過程中接頭界面金屬間化合物(IMC)生長行為.結(jié)果表明,在接頭界面處,金屬間化合物層由連續(xù)的β-Al_3Mg_2(靠近鋁側(cè))相和γ-Al_(12)Mg_(17)靠近鎂側(cè))相組成.IMC層的厚度隨著時間延長或者溫度的提高而增加,并且β-Al_3Mg_2相生長快于γ-Al12Mg17相.整個IMC層的生長厚度與退火時間的平方根成線性關(guān)系,其生長受擴散機制影響.隨著溫度從300℃增加到400℃,IMC層生長的擴散系數(shù)從2.88×10~(-14)m~2/s增加到3.67×10~(-13)m~2/s.界面IMC層的生長激活能為82.5 kJ/mol.
[Abstract]:The microstructure of 6061Al aluminum alloy and AZ31B magnesium alloy in friction stir lap welding (FSLW) joint and the growth behavior of intermetallic compound (IMC) at the interface of (FSLW) joint during post-weld heat treatment were studied. The results show that, at the interface of the joint, The intermetallic compound layer is composed of continuous 尾-Al_3Mg_2 (near the aluminum side) phase and 緯-Al_ (12) Mg_ (17) near the magnesium side. The thickness of the IMC layer increases with the increase of time or temperature. 尾-Al_3Mg_2 phase grew faster than 緯-Al12Mg17 phase. The growth thickness of the whole IMC layer is linearly related to the square root of annealing time, and its growth is affected by the diffusion mechanism. With the increase of temperature from 300 鈩，

本文編號：2294605