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陶瓷元件免燒型賤金屬電極制備技術研究

發(fā)布時間:2018-10-18 21:00
【摘要】:近年來,隨著各種電子產(chǎn)品的普及以及更新?lián)Q代的速度加快,具有體積小、容量大、耐腐蝕、耐高溫等優(yōu)點的陶瓷電容器的市場需求量與日俱增。陶瓷電容器的電極材料一般采用貴金屬銀,其高昂的價格使得陶瓷電容器成本偏高,采用賤金屬電極代替貴金屬電極已成為陶瓷電容器行業(yè)發(fā)展的必然趨勢。本論文圍繞陶瓷電容器電極賤金屬化展開研究。本論文選取賤金屬銅為電極材料,采用化學鍍法來實現(xiàn)陶瓷電極賤金屬化。利用噴墨打印技術在陶瓷基材上形成圖形化的活化層,以此作為后續(xù)化學沉銅的催化種子層。以金屬銅層的外觀色澤、微觀形貌、方阻以及附著力為考察指標,優(yōu)化化學沉銅的溫度以及沉積時間。結(jié)果表明,在沉積溫度為45~50℃,沉積時間約為20 min條件下,所得到的銅層外觀色澤光亮,銅顆粒大小較均勻,方阻以及附著力最佳。論文在優(yōu)化施鍍工藝條件基礎上,以傳統(tǒng)化學鍍銅效果為參照,探討了超聲輔助化學鍍的超聲參數(shù)對鍍層質(zhì)量的影響。結(jié)果表明,在化學沉銅過程中引入超聲輔助沉積可有效提高電極質(zhì)量,這是因為超聲波在化學沉積中能促進氫氣的排出,加快沉積速度,提升鍍層的結(jié)合力。在噴墨印制化學沉銅催化種子層前對陶瓷基材進行粗化預處理,探討了粗化時間對銅層附著力的影響。在優(yōu)化制備條件下所得到的銅電極色澤光亮、銅顆粒致密均勻、銅層抗熔蝕性強、可焊性優(yōu)良,銅層在陶瓷基材上的附著力可達到2.6kg/cm2,電阻率低至3.6μ?·cm。銅電極陶瓷電容器的電容量和損耗均達到了工業(yè)應用要求。本論文所開發(fā)的陶瓷電容器賤金屬電極制備技術具有工藝簡單、成本低、可批量化制備的優(yōu)點,且整個制備過程無需高溫燒結(jié),即可獲得性能優(yōu)良的賤金屬電極。這可為陶瓷電容器電極的賤金屬化提供實用的技術參考。
[Abstract]:In recent years, with the popularity of various electronic products and the speed of upgrading, the market demand of ceramic capacitors with the advantages of small volume, large capacity, corrosion resistance and high temperature resistance is increasing day by day. The electrode material of ceramic capacitor is usually made of precious metal silver, and its high price makes the cost of ceramic capacitor on the high side. It has become an inevitable trend of ceramic capacitor industry to replace precious metal electrode with base metal electrode. In this paper, the base metal of ceramic capacitor electrode is studied. In this paper, base metal copper is chosen as electrode material and electroless plating method is used to realize base metal of ceramic electrode. The ink-jet printing technique was used to form a graphical activation layer on the ceramic substrate, which was used as the catalytic seed layer for the subsequent chemical deposition of copper. The temperature and deposition time of copper deposition were optimized by using the appearance, color, micromorphology, square resistance and adhesion of metal copper layer as the index of investigation. The results show that when the deposition temperature is 45 ~ 50 鈩,

本文編號:2280352

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