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氮化硅陶瓷精密磨削仿真與實(shí)驗(yàn)研究

發(fā)布時(shí)間:2018-03-19 13:31

  本文選題:氮化硅陶瓷 切入點(diǎn):單顆磨粒切削 出處:《湖南科技大學(xué)》2017年碩士論文 論文類型:學(xué)位論文


【摘要】:工程陶瓷材料以其高強(qiáng)度、高硬度、耐磨、耐高溫、耐化學(xué)腐蝕等優(yōu)良性能,在航空航天、國(guó)防軍工和現(xiàn)代醫(yī)學(xué)等重要領(lǐng)域得到廣泛的應(yīng)用。為了達(dá)到高質(zhì)、高效、低成本等要求,目前在工程陶瓷的加工方法中最為成熟、實(shí)用,且應(yīng)用最為廣泛的仍是采用超硬金剛石磨料磨具進(jìn)行磨削加工。磨削加工可視為大量離散分布在砂輪表面的磨粒同時(shí)與被加工材料相互作用實(shí)現(xiàn)材料去除的過(guò)程,而每一個(gè)磨粒都存在很多的磨刃,在一定程度上類似于刀具的切削加工,即每一個(gè)磨粒都可視為若干車刀的組合。但是磨削加工又比車削復(fù)雜很多,因?yàn)閰⑴c磨削的磨粒數(shù)量多,磨粒切削刃形狀、尺寸、位置的隨機(jī)多樣性以及磨削工藝參數(shù)等多種因素相互影響,使得研究磨削加工材料去除機(jī)理異常困難。為深入探討磨削加工機(jī)理,可以從單顆磨粒切削加工研究出發(fā),將單顆磨粒切削結(jié)果在磨削加工區(qū)域進(jìn)行有效集成,進(jìn)而解釋磨削加工過(guò)程中的各種物理現(xiàn)象,因此單顆磨粒切削加工的機(jī)理研究成為認(rèn)識(shí)復(fù)雜磨削加工機(jī)理的一種重要手段。本文以氮化硅陶瓷精密磨削加工為研究對(duì)象,在對(duì)砂輪表面磨粒形貌和氮化硅工件表面、亞表面形貌進(jìn)行檢測(cè)分析的基礎(chǔ)上,建立截角多面體單顆磨粒虛擬模型和含有典型裂紋的工件模型進(jìn)行單顆磨粒切削仿真,并通過(guò)切削實(shí)驗(yàn)對(duì)仿真結(jié)果進(jìn)行驗(yàn)證。同時(shí)根據(jù)單顆磨粒模型建立虛擬砂輪模型,基于第一應(yīng)力理論進(jìn)行磨削損傷仿真,提出一種基于光照強(qiáng)度的損傷檢測(cè)方法并對(duì)損傷深度進(jìn)行測(cè)量,最后通過(guò)實(shí)驗(yàn)對(duì)仿真結(jié)果進(jìn)行驗(yàn)證、對(duì)損傷預(yù)測(cè)模型進(jìn)行回歸分析和驗(yàn)證。具體研究工作內(nèi)容包括:1)根據(jù)單顆磨粒實(shí)際尺寸范圍和形狀,通過(guò)球坐標(biāo)系對(duì)其尺寸進(jìn)行限制后,運(yùn)用隨機(jī)點(diǎn)產(chǎn)生的空間平面再去切分實(shí)體和截角多面體相結(jié)合的方法建立了截角多面體虛擬磨粒(截面以三到六邊形為主)。建立包含Ⅰ型(張開型)和Ⅱ型(滑開型)典型裂紋的工件模型,然后進(jìn)行單顆磨粒切削仿真,基于第一強(qiáng)度理論對(duì)材料去除過(guò)程展開分析,并在數(shù)控平面磨床上進(jìn)行單顆磨粒切削加工實(shí)驗(yàn),對(duì)仿真模型進(jìn)行驗(yàn)證。2)基于單顆磨粒切削氮化硅陶瓷的加工路徑規(guī)劃及未變形切屑厚度計(jì)算模型,建立各加工參數(shù)與表面殘留高度之間的數(shù)學(xué)模型。通過(guò)單顆磨粒切削氮化硅陶瓷加工實(shí)驗(yàn),研究加工參數(shù)對(duì)表面殘留高度的影響并以降低殘留高度為目標(biāo)對(duì)加工參數(shù)進(jìn)行優(yōu)化,同時(shí)分析了材料去除方式與殘留高度的關(guān)系。并將優(yōu)化結(jié)果引入到磨削加工中并通過(guò)磨削實(shí)驗(yàn)對(duì)優(yōu)化結(jié)果進(jìn)行驗(yàn)證。3)結(jié)合實(shí)驗(yàn)中加工參數(shù)與切削力之間的關(guān)系,建立各個(gè)加工參數(shù)與力之間的擬合函數(shù)關(guān)系式,并根據(jù)擬合函數(shù)的斜率大小得出在本文設(shè)定的加工范圍中,進(jìn)給量對(duì)切削力的影響程度最大,工件速度對(duì)切削力影響程度最小。在對(duì)加工參數(shù)與切削力的擬合函數(shù)進(jìn)行無(wú)量綱處理的基礎(chǔ)上,結(jié)合切削力與加工質(zhì)量成負(fù)相關(guān)關(guān)系這一規(guī)律,以切削力為因變量對(duì)加工參數(shù)的選擇范圍進(jìn)行優(yōu)化,并通過(guò)單顆磨粒實(shí)驗(yàn)對(duì)優(yōu)化結(jié)果進(jìn)行驗(yàn)證。4)基于金剛石砂輪磨削加工理論基礎(chǔ)和砂輪表面形貌建模,以截角多面體磨粒為基礎(chǔ)建立優(yōu)化的局部砂輪仿真模型,并根據(jù)第一強(qiáng)度理論對(duì)磨削加工亞表面損傷深度進(jìn)行仿真研究。通過(guò)使用角度拋光法對(duì)實(shí)驗(yàn)工件亞表面損傷深度進(jìn)行測(cè)量后,對(duì)損傷預(yù)測(cè)模型進(jìn)行回歸分析和驗(yàn)證,并根據(jù)不同材料和同一材料不同損傷狀況對(duì)光的反射程度不同,提出一種通過(guò)尋找最佳光照強(qiáng)度的新的損傷測(cè)量方法對(duì)損傷深度進(jìn)行測(cè)量,最后再結(jié)合實(shí)驗(yàn)結(jié)果對(duì)加工參數(shù)與損傷深度的影響規(guī)律展開分析。
[Abstract]:Engineering ceramic materials with high strength, high hardness, wear resistance, high temperature resistance, excellent resistance to chemical corrosion, in the aerospace, widely used in important areas of national defense and modern medicine. In order to achieve high quality, high efficiency, low cost, the processing method in engineering ceramics in the most mature and practical, and the most widely used is made of super hard diamond abrasive tools for grinding. Grinding can be regarded as a discrete distribution in the abrasive and grinding wheel surface and the machined material interaction process of material removal, and each one has a lot of abrasive grinding and cutting tool similar to to a certain extent, each particle can be regarded as a combination of several tools. But the grinding and turning complex many, because in grinding abrasive abrasive cutting edge number, shape, size, position Many factors were diversity and grinding process parameters influence each other, makes the research on grinding mechanism of material removal is very difficult. In order to further explore the mechanism of grinding, from single abrasive grain cutting processing research of the single grain cutting results are effectively integrated in the grinding area, and then explain the various phenomena of grinding in the process, so the single grain cutting mechanism has become an important means for understanding the processing mechanism of complex grinding. The precision grinding of silicon nitride ceramics as the research object, on the surface of abrasive grinding wheel and the workpiece surface morphology of silicon nitride based, detection and analysis of surface topography on workpiece model a truncated polyhedral single particle model and virtual crack were carried out with a typical single grain cutting simulation, and through the cutting experiment of simulation results was verified. At the same time according to the single particle model of virtual grinding wheel model, the first stress theory of grinding damage simulation based on damage detection method is proposed based on light intensity and measure the depth of damage, finally through the experiment to verify the simulation results, the damage prediction model by regression analysis and verification. The research contents include: 1) according to the actual single grain size range and shape, the restriction on the size of the spherical coordinate system, using the method of space plane random point to segmentation entity and combining truncated polyhedra established truncated polyhedra virtual abrasive (section three to hexagonal mainly includes the establishment of type I). (Zhang Kaixing) and type II (sliding type) workpiece model of typical cracks, then single grain cutting simulation, analyzes the first strength theory on the material removal process based on numerical control and The plane grinding machine for single abrasive machining experiments verify the simulation model.2) calculation model of single grain cutting of silicon nitride ceramics machining path planning and undeformed chip thickness based on the mathematical model established between the processing parameters and the surface residual height. Through single grain cutting machining of silicon nitride ceramics experiment research of process parameters on surface residual height influence and to reduce the residual height on the processing parameters were optimized, and analyzed the material removal modes and residual height relationship. And the optimization results are introduced to the grinding processing and the optimization results of grinding experiments to verify the.3) combined with the relationship between machining parameters and cutting in the experiment, the fitting function between the establishment of various processing parameters and force, and according to the result of the slope of the fitting function in the processing of the scope of this set in, Influence of feed rate on cutting force of the maximum, minimum influence of workpiece speed on the cutting force. The fitting function of machining parameters and cutting force based on dimensional processing, combined with the cutting force of this Law and negatively correlated with the processing quality, the cutting force as the dependent variable selection range of processing parameters optimization and particle experiments were performed to validate the.4 results of optimization by single abrasive diamond wheel grinding) theory and grinding wheel surface topography modeling based on the truncated polyhedra abrasive to establish local wheel simulation model optimization as the foundation, according to the first strength theory for simulation research of the subsurface damage measurement of grinding depth. The workpiece subsurface damage depth by using the angle polishing method, the damage prediction model by regression analysis and verification, and according to different materials and different materials of the same The damage degree is different from the light reflection degree. A new damage measurement method based on finding the best light intensity is proposed to measure the depth of damage. Finally, combined with the experimental results, the influence rule of processing parameters and damage depth is analyzed.

【學(xué)位授予單位】:湖南科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類號(hào)】:TQ174.6

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