激光加熱固化設備關鍵技術研究
發(fā)布時間:2019-03-13 12:20
【摘要】:激光加熱固化設備由激光加熱固化裝置和纖維纏繞成型裝置共同構成,在碳纖維復合材料纏繞的同時利用半導體激光器對復合材料進行加熱,能夠使復合材料纏繞更加均勻,與其他加熱方式相比較,激光加熱固化時間更短,固化效果更好,裝置更簡單。論文綜述了激光加熱固化技術和纖維纏繞成型技術的國內外現(xiàn)狀,詳細介紹了碳纖維和環(huán)氧樹脂的特點及性能,闡述了碳纖維-環(huán)氧樹脂復合材料纏繞成型工藝及其特點。應用ANSYS有限元分析軟件對復合材料加熱固化過程進行溫度場分布的計算模擬,獲得了動態(tài)纏繞過程中復合材料的溫度場分布。提出了一種回轉體纏繞的激光加熱固化實驗研究方案,針對半導體激光器的輸出的光場分布特性,應用ZEMAX軟件仿真模擬了含有三個bar條的半導體激光器陣列的傳輸特性,采用三個微柱面鏡對半導體激光陣列的快軸整形獲得了尺寸為1.2mm×10mm的輻照光斑;設計了一維運動與一維回轉相結合的二維運動工作臺及其運動控制單元,通過上位機來控制二維運動臺的運動速度;采用張力控制裝置實現(xiàn)復合材料帶的預緊;采用紅外測溫技術實現(xiàn)輻照的復合材料表面的溫度測量,通過功率反饋控制電路實現(xiàn)激光輻照功率的調節(jié),搭建了激光加熱固化實驗裝置。在輻照功率為60W時,復合材料表面加熱溫度為200℃±10℃,經測定復合材料的剪切強度達到了60MPa。
[Abstract]:The laser heating and curing equipment is composed of a laser heating curing device and a filament winding molding device. While the carbon fiber composite material is wound, a semiconductor laser is used to heat the composite material, which can make the composite winding more uniform. Compared with other heating methods, laser heating has shorter curing time, better curing effect and simpler device. In this paper, the present situation of laser heating curing technology and filament winding molding technology at home and abroad is reviewed. The characteristics and properties of carbon fiber and epoxy resin are introduced in detail, and the winding process and characteristics of carbon fiber-epoxy resin composites are described in detail. The temperature distribution of composites during heating and curing process was simulated by using ANSYS finite element analysis software, and the temperature distribution of composites during dynamic winding was obtained. An experimental scheme of laser heating solidification with rotating body winding is proposed. Aiming at the light field distribution of semiconductor laser output, the transmission characteristics of semiconductor laser array with three bar bars are simulated by ZEMAX software. Three microcylindrical mirrors were used to shape the fast axis of the semiconductor laser array and the irradiated spot with the size of 1.2mm 脳 10mm was obtained. A two-dimensional moving table combined with one-dimensional motion and one-dimensional rotation and its motion control unit are designed to control the motion speed of the two-dimensional moving table through the upper computer, and the tension control device is used to realize the pre-tightening of the composite belt. The infrared temperature measurement technique was used to measure the surface temperature of irradiated composite materials. The laser irradiation power was adjusted by power feedback control circuit, and the experimental equipment of laser heating and curing was set up. When the irradiation power is 60 W, the surface heating temperature of the composite is 200 鈩,
本文編號:2439383
[Abstract]:The laser heating and curing equipment is composed of a laser heating curing device and a filament winding molding device. While the carbon fiber composite material is wound, a semiconductor laser is used to heat the composite material, which can make the composite winding more uniform. Compared with other heating methods, laser heating has shorter curing time, better curing effect and simpler device. In this paper, the present situation of laser heating curing technology and filament winding molding technology at home and abroad is reviewed. The characteristics and properties of carbon fiber and epoxy resin are introduced in detail, and the winding process and characteristics of carbon fiber-epoxy resin composites are described in detail. The temperature distribution of composites during heating and curing process was simulated by using ANSYS finite element analysis software, and the temperature distribution of composites during dynamic winding was obtained. An experimental scheme of laser heating solidification with rotating body winding is proposed. Aiming at the light field distribution of semiconductor laser output, the transmission characteristics of semiconductor laser array with three bar bars are simulated by ZEMAX software. Three microcylindrical mirrors were used to shape the fast axis of the semiconductor laser array and the irradiated spot with the size of 1.2mm 脳 10mm was obtained. A two-dimensional moving table combined with one-dimensional motion and one-dimensional rotation and its motion control unit are designed to control the motion speed of the two-dimensional moving table through the upper computer, and the tension control device is used to realize the pre-tightening of the composite belt. The infrared temperature measurement technique was used to measure the surface temperature of irradiated composite materials. The laser irradiation power was adjusted by power feedback control circuit, and the experimental equipment of laser heating and curing was set up. When the irradiation power is 60 W, the surface heating temperature of the composite is 200 鈩,
本文編號:2439383
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