多芯片組件的擴展熱阻與熱耦合效應(yīng)研究
[Abstract]:With the rapid development of science and technology, multi-chip module technology has become a hot spot in the field of electronic products because of its small size, high assembly density, high performance and high reliability. At the same time, the function of the product is increasing, the power consumption per unit volume is increasing, and the heat flux inside the equipment is increasing. Finally, the temperature of the electronic component is too high, which seriously affects the reliability of the product. Heat dissipation has become an indispensable task in the application of electronic equipment. In this paper, the following work is carried out through the combination of theory, simulation and experiment. Firstly, the characteristics of various related calculation theories are compared and analyzed by taking the extended thermal resistance of a single chip assembly as the research object. For the simple rectangular heat source model, the correctness of the simulation calculation is verified by comparing the theoretical calculation with the FLOEFD simulation analysis. On this basis, the law of variation between the extended thermal resistance and the influence parameters of the model is studied, and the response model of the extended thermal resistance on each factor is obtained by using the response surface method, which provides a scheme reference for further improving the heat dissipation performance of electronic products. Secondly, in view of the thermal coupling effect of multi-chip components, the temperature of two chip components and four chip components are calculated by establishing thermal resistance network model and thermal resistance matrix, respectively, and compared with the simulation value of FLOEFD. Verify the correctness of the simulation calculation; Then, the influence of the model parameters on the thermal coupling effect is studied by simulation analysis, which has reference significance for the thermal reliability design of multi-chip modules. Finally, in order to verify the thermal resistance characteristics of multi-chip modules, a thermal experimental platform is designed and built for the extended thermal resistance model and the thermal coupling model, so that the temperature of the chip or substrate can be measured. On this basis, the experimental results are compared with the software simulation through data processing to verify the variation of the thermal resistance of the model and the parameters, and the possible errors in the experiment are analyzed.
【學(xué)位授予單位】:西安電子科技大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2015
【分類號】:TN02
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