【摘要】：為迎合現代社會對電子產品的集成化、便攜化要求,PCB板正在向著高密度、多層化、輕薄化發(fā)展,PCB板上的微孔加工,是電子元器件實現電氣互聯的必要工序。本文一方面針對PCB板自身結構及其材料配比在超高轉速的條件下對PCB板機械鉆削性能的影響進行了一系列實驗研究,將PCB板中各材料的質量比重定義為四個等級,并以5種典型PCB板中各材料的質量等級為參考,基于實驗結果,采用對比分析的方法提出了分別以鉆削溫度、軸向力、微孔質量為指向的PCB優(yōu)化方案。另一方面將PCB微孔鉆削簡化為對銅箔和多層玻璃纖維復合材料(GFRP)的鉆削,在ABAQUS中成功建立了銅箔及多層GFRP有限元模型,并在超高轉速條件下對兩者進行了鉆削模擬,且仿真有效。在實驗研究方面,先后進行了鉆削溫度、軸向力以及孔質量的探究,以對比分析方法分析了PCB板材結構及各材料含量對鉆削溫度、鉆削力、孔質量的影響,并歸納出以溫度、鉆削力、孔質量為指向的PCB結構及材料優(yōu)化方案:以更優(yōu)軸向力特性為目標的PCB鉆孔,宜選用填料含量在16%-30%且樹脂含量在31%-50%的雙面PCB板;以取得更低鉆削溫度或更優(yōu)孔質量為目標的PCB鉆孔,應選用填料含量在31%-50%和樹脂含量在16%-30%的多層PCB板,填料尺寸小且分布均勻時其效果更佳。在仿真研究方面,建立了基于Hasin損傷準則的多層GFRP有限元模型,和基于Johnson-cook剪切準則的銅箔有限元模型,并分別對兩者進行鉆削模擬。銅箔鉆削仿真結果顯示,在超高速鉆削條件下,鉆頭兩主切削刃溫度分布明顯不均,且主軸轉速越高,這一現象越明顯,溫差隨鉆削深度加大而加劇。GFRP鉆削仿真結果顯示,鉆削多層GFRP的應力可看作分別鉆削單層復合材料的應力疊加,且疊加層數越多,層與層之間相互干涉程度越大;基體總是先于纖維破壞,且損傷程度高于纖維;纖維主要受到拉伸作用;多層GFRP孔較銅箔孔有明顯的撕裂、起毛、分層現象,且隨主軸轉速降低而加劇。
[Abstract]:In order to meet the integration of electronic products in modern society, portable PCB board is developing towards high density, multilayer and thinning, which is the necessary procedure for electronic components to realize electrical interconnection. On the one hand, a series of experiments have been carried out to study the influence of the structure of PCB plate and its material ratio on the mechanical drilling performance of PCB plate under the condition of ultra-high speed. The weight specific gravity of each material in PCB plate is defined as four grades. Based on the experimental results, a PCB optimization scheme with drilling temperature, axial force and micropore mass as the direction is proposed based on the experimental results and the reference of each material quality grade in five typical PCB boards. On the other hand, PCB microhole drilling is simplified as drilling copper foil and multilayer glass fiber composite (GFRP). The finite element model of copper foil and multilayer GFRP is successfully established in ABAQUS. And the simulation is effective. In the aspect of experimental research, drilling temperature, axial force and hole quality have been studied successively. The effects of structure and material content of PCB sheet on drilling temperature, drilling force and hole quality have been analyzed by comparative analysis, and the temperature has been summarized. Drilling force and pore quality oriented PCB structure and material optimization scheme: for PCB drilling with better axial force characteristics, the double-sided PCB plate with packing content of 16-30% and resin content of 31- 50% should be selected. In order to obtain lower drilling temperature or better hole quality, multilayer PCB plates with packing content of 31% -50% and resin content of 16% -30% should be selected for PCB drilling. The effect is better when the packing size is small and the distribution is uniform. In the aspect of simulation, multi-layer GFRP finite element model based on Hasin damage criterion and copper foil finite element model based on Johnson-cook shearing criterion are established. The simulation results of copper foil drilling show that the temperature distribution of the two main cutting edges of the bit is obviously uneven under ultra-high speed drilling conditions, and the higher the spindle speed is, the more obvious this phenomenon is, and the temperature difference increases with the drilling depth. The simulation results show that the temperature difference increases with the drilling depth. The stress of multi-layer GFRP can be regarded as the superposition of the stress of single layer composites, and the more the number of stacked layers, the greater the degree of interference between layers, the matrix is always destroyed before fiber, and the degree of damage is higher than that of fiber. The fiber is mainly subjected to tensile action, and the multilayer GFRP pore has obvious tearing, piling and delamination phenomenon compared with the copper foil hole, and it is aggravated with the decrease of the spindle speed.
【學位授予單位】：深圳大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TN41;TG52

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