【摘要】：在電流密度1.94 A/dm~2、溫度25°C和空氣攪拌的條件下,采用由220 g/L CuSO_4·5H_2O、0.54 mol/L H_2SO_4和4種添加劑組成的酸性鍍銅液對PCB(印制線路板)微盲孔進行填充。所用添加劑包含Cl-、加速劑(聚二硫二丙烷磺酸鈉,SPS)、抑制劑(聚乙二醇-8000,PEG-8000)和整平劑(4,6-二甲基-2-巰基嘧啶,DMP)。通過電化學阻抗譜和陰極極化曲線分析了上述4種添加劑的用量對微盲孔填充效果的影響。結果表明:當Cl-為30~60 mg/L、SPS為0.5~1.0 mg/L,PEG-8000為100~300 mg/L、DMP為1~7 mg/L時,填孔效率最佳,所得鍍層表面結構均勻、致密,耐浸錫熱沖擊和抗高低溫循環(huán)的性能良好,滿足PCB的可靠性要求。
[Abstract]:Under the condition of current density of 1.94 A / D ~ (2), temperature of 25 擄C and air agitation, acid copper plating solution consisting of 220 g / L Cuso _ 4 / L Cuso _ (4) H _ 2O _ (4) 0.54 mol / L / L S _ 2SO _ 4 and 4 additives was used to fill the printed circuit board (PCB) microblind holes. The additives used include Cl-accelerator (SPS), inhibitor (PEG-8000) and leveling agent (4-dimethyl-2-mercaptopyrimidine). By electrochemical impedance spectroscopy and cathodic polarization curves, the effects of the contents of the four additives on the effect of microblind hole filling were analyzed. The results show that when the Cl- is 30 ~ (60) mg / L ~ (-1) SPS = 0.5 ~ (1.0) mg / L ~ (-1) PEG-8000 is 100 ~ 300 mg / L DMP = 1 ~ 7 mg / L, the surface structure of the coating is uniform and dense, and the properties of heat shock resistance and high and low temperature cycle resistance are good, which can meet the reliability requirements of PCB.
【作者單位】： 重慶大學化學化工學院;博敏電子股份有限公司;電子科技大學微電子與固體電子學院;
【基金】：國家自然科學基金(21376282) 廣東省“揚帆計劃”先進印制電路關鍵技術研發(fā)及產(chǎn)業(yè)化項目(2015YT02D025) 汽車電子用高密度智能控制印制電路關鍵技術及產(chǎn)業(yè)化項目(2015B090901032)
【分類號】：TN41

【參考文獻】

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1 彭佳;程驕;王，

本文編號：2125084