發(fā)布時(shí)間：2018-06-12 09:13

  本文選題：引線鍵合 + 視覺(jué)定位　； 參考：《西安工業(yè)大學(xué)》2015年碩士論文

【摘要】：IC(集成電路)產(chǎn)業(yè)是衡量一個(gè)國(guó)家綜合實(shí)力的重要指標(biāo),是轉(zhuǎn)變發(fā)展模式、提升工業(yè)水平的重要依托。而集成電路封裝技術(shù)是IC芯片成為具有實(shí)用價(jià)值的微電子器件的橋梁,因此研究作為集成電路封裝技術(shù)中最常用的引線鍵合技術(shù)具有重要意義。機(jī)器視覺(jué)技術(shù)以其非接觸性、高效率、高精度等優(yōu)點(diǎn)在自動(dòng)化生產(chǎn)中發(fā)揮越來(lái)越重要的作用。同時(shí)為了滿足引線鍵合技術(shù)高集成化、高精度化、高細(xì)密化的的要求,本論文將機(jī)器視覺(jué)技術(shù)引入引線鍵合中,以面向引線鍵合的視覺(jué)定位系統(tǒng)為研究對(duì)象,根據(jù)引線鍵合對(duì)視覺(jué)系統(tǒng)的要求搭建實(shí)驗(yàn)平臺(tái),結(jié)合機(jī)器視覺(jué)技術(shù)和圖像處理技術(shù)設(shè)計(jì)軟件定位算法。本文研究的主要內(nèi)容如下：首先,對(duì)引線鍵合視覺(jué)定位系統(tǒng)進(jìn)行整體設(shè)計(jì),包括實(shí)驗(yàn)平臺(tái)設(shè)計(jì)和軟件算法設(shè)計(jì),實(shí)驗(yàn)平臺(tái)設(shè)計(jì)部分包含硬件選型、光學(xué)成像系統(tǒng)的設(shè)計(jì)等內(nèi)容；軟件算法設(shè)計(jì)部分包含角點(diǎn)檢測(cè)、修正量計(jì)算等內(nèi)容。并且著重對(duì)整個(gè)定位系統(tǒng)中出現(xiàn)的誤差進(jìn)行了分析,具體包括：圖像獲取時(shí)的鏡頭畸變誤差、芯片制造和貼片誤差、軟件定位算法誤差,通過(guò)對(duì)誤差的分析,從而對(duì)整個(gè)視覺(jué)定位算法的優(yōu)劣性進(jìn)行準(zhǔn)確評(píng)估。其次,針對(duì)系統(tǒng)的實(shí)驗(yàn)平臺(tái)部分,對(duì)獲取圖像的攝像機(jī)鏡頭進(jìn)行誤差的評(píng)定算法設(shè)計(jì)。該算法采用了傳統(tǒng)的攝像機(jī)標(biāo)定算法,以平面圓點(diǎn)陣列型靶標(biāo)作為研究對(duì)象,通過(guò)獲取的單幀模板圖像可求得攝像機(jī)的內(nèi)外參數(shù),同時(shí)計(jì)算得到圖像的鏡頭畸變誤差,并以此作為圖像畸變矯正是否進(jìn)行的依據(jù)。經(jīng)仿真實(shí)驗(yàn)驗(yàn)證,本算法計(jì)算精度和效率均較高,同時(shí)需要強(qiáng)調(diào)的是該算法具有較強(qiáng)的普遍適用性。最后,針對(duì)裸芯片、基座圖像的特點(diǎn),提出一種基于matlab的軟件平臺(tái)對(duì)系統(tǒng)進(jìn)行定位算法設(shè)計(jì),實(shí)時(shí)的校正在引線鍵合過(guò)程中由貼片和芯片制造產(chǎn)生的誤差。通過(guò)對(duì)裸芯片、基座圖像邊緣的特點(diǎn)進(jìn)行分析,本文采用基于幾何中心的算法提取出裸芯片、基座圖像的虛擬角點(diǎn),得到二者的實(shí)際位置坐標(biāo),從而得到二者位移和角度的修正量,并將其結(jié)果反饋到鍵合頭,可完成高精度、高效率的鍵合。經(jīng)過(guò)仿真實(shí)驗(yàn)驗(yàn)證,該算法可以實(shí)現(xiàn)鍵合過(guò)程中裸芯片、基座位置偏差的實(shí)時(shí)校正,并且定位精度滿足引線鍵合的工藝要求。綜上所述,本論文對(duì)引線鍵合視覺(jué)定位系統(tǒng)進(jìn)行了深入的研究,對(duì)所設(shè)計(jì)的算法均經(jīng)過(guò)仿真實(shí)驗(yàn)驗(yàn)證,實(shí)驗(yàn)結(jié)果表明本文提出的算法均具有較高的檢測(cè)精度和識(shí)別率,達(dá)到了比較好的效果。本論文取得的研究成果對(duì)于機(jī)器視覺(jué)定位檢測(cè)技術(shù)、圖像畸變矯正技術(shù)、虛擬角點(diǎn)檢測(cè)技術(shù)均具有一定的理論價(jià)值和實(shí)用價(jià)值。
[Abstract]:IC (integrated circuit) industry is an important index to measure a country's comprehensive strength, it is an important support to change the development mode and improve the industrial level. The integrated circuit packaging technology is the bridge of IC chip to become the microelectronic device with practical value, so it is of great significance to study the lead bonding technology which is the most commonly used in the integrated circuit packaging technology. Machine vision technology plays a more and more important role in automatic production because of its advantages of non-contact, high efficiency and high precision. At the same time, in order to meet the requirements of high integration, high precision and high fineness of wire bonding technology, this paper introduces machine vision technology into lead bonding, and takes the lead bonding oriented vision positioning system as the research object. An experimental platform is built according to the requirements of lead bonding for visual system. Combined with machine vision technology and image processing technology, software positioning algorithm is designed. The main contents of this paper are as follows: first, the overall design of the lead bond vision positioning system, including the experimental platform design and software algorithm design, the experimental platform design part includes hardware selection, optical imaging system design content; The software algorithm design includes corner detection, correction calculation and so on. The errors in the whole positioning system are analyzed, including lens distortion error, chip manufacturing and patch error, software positioning algorithm error. Therefore, the advantages and disadvantages of the whole vision location algorithm are evaluated accurately. Secondly, the error evaluation algorithm of the camera lens is designed for the experimental platform of the system. This algorithm adopts the traditional camera calibration algorithm and takes the planar dot array target as the research object. The internal and external parameters of the camera can be obtained by the obtained single frame template image, and the lens distortion error of the obtained image can be calculated at the same time. And this is used as the basis of image distortion correction. The simulation results show that the algorithm is accurate and efficient, and it should be emphasized that the algorithm is widely applicable. Finally, according to the characteristics of bare chip and pedestal image, a software platform based on matlab is proposed to design the positioning algorithm of the system, and to correct the errors produced by the chip and the chip in the process of lead bonding in real time. By analyzing the characteristics of the bare chip and the edge of the base image, the algorithm based on geometric center is used to extract the virtual corner of the bare chip and the image of the base, and the actual position coordinates of the two are obtained. The modified displacement and angle can be obtained, and the results can be fed back to the bonding head, which can achieve high precision and high efficiency bonding. The simulation results show that the algorithm can realize the real-time correction of the position deviation of the bare chip and the base during the bonding process, and the positioning accuracy can meet the technological requirements of the lead bonding. To sum up, this paper has carried on the thorough research to the lead bond vision localization system, all the designed algorithms have been verified by the simulation experiment, the experimental results show that the proposed algorithm has a high detection accuracy and recognition rate. Good results have been achieved. The research results obtained in this paper have certain theoretical and practical value for machine vision positioning detection technology, image distortion correction technology, virtual corner detection technology.
【學(xué)位授予單位】：西安工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405;TP391.41

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本文編號(hào)：2009160