本文選題：LED封裝 + 熱設(shè)計(jì)�。� 參考：《中國科學(xué):技術(shù)科學(xué)》2017年09期

【摘要】：發(fā)光二極管(light-emitting diode,LED)具有電光轉(zhuǎn)換效率高、節(jié)能環(huán)保、體積小等優(yōu)點(diǎn),被譽(yù)為21世紀(jì)綠色照明光源.隨著LED在越來越多的照明場合的應(yīng)用推廣和人們對(duì)于光源質(zhì)量的要求的提高,LED出光品質(zhì)越來越被重視.評(píng)價(jià)LED出光品質(zhì)的指標(biāo)主要有效率、空間顏色均勻性和顯色指數(shù),這些參數(shù)和LED封裝密切相關(guān).LED封裝是將芯片和其他封裝材料集成在一起形成最終的照明產(chǎn)品,起著機(jī)械保護(hù)、外部信號(hào)和電連接、散熱和光學(xué)參數(shù)調(diào)控等關(guān)鍵性功能.本文從封裝的角度,對(duì)LED的效率、空間顏色均勻性和顯色指數(shù)的調(diào)控技術(shù)進(jìn)行了系統(tǒng)闡述.具體到封裝中的關(guān)鍵技術(shù),主要包含以下3方面:(1)熱設(shè)計(jì).LED在工作過程中約有60%的輸入電能被轉(zhuǎn)化為熱量,如果產(chǎn)生的熱量不能及時(shí)有效地散到環(huán)境中,將會(huì)造成LED的溫度急劇升高,導(dǎo)致LED的效率下降并帶來可靠性問題.(2)光學(xué)設(shè)計(jì).LED的光從芯片有源層中通過電子-空穴復(fù)合的方式產(chǎn)生后,在經(jīng)過芯片、熒光粉、封裝膠和透鏡等材料后,由于散射和折射等作用,光的傳播方向和路徑會(huì)發(fā)生改變.此外由于吸收作用,部分的光被吸收并轉(zhuǎn)換成熱量.因此通過光學(xué)設(shè)計(jì)不僅可以調(diào)控LED光源能量分布,還可以減少光在封裝材料中的吸收從而提高光效.(3)熒光粉涂覆.相比于多色發(fā)光LED芯片組合獲得期望出光品質(zhì)LED的封裝形式,將單色或者多色熒光粉涂覆在單色LED芯片上的封裝形式具有更強(qiáng)的相關(guān)色溫可調(diào)性和工藝靈活性而被廣泛應(yīng)用于LED工業(yè)生產(chǎn)中.對(duì)于熒光粉結(jié)合芯片的白光LED封裝形式,熒光粉涂覆起著調(diào)控空間顏色均勻性和顯色指數(shù)的關(guān)鍵作用.
[Abstract]:Light emitting Diode (LED) has the advantages of high efficiency of electro-optic conversion, energy saving and environmental protection, small volume and so on. It is praised as the green lighting source in the 21st century. With the application of LED in more and more lighting occasions and the improvement of the quality of light source, more and more attention has been paid to the quality of LED. The main indexes to evaluate the light quality of LED are efficiency, spatial color uniformity and color rendering index. These parameters are closely related to LED packaging. It is the integration of chips and other packaging materials to form the final lighting product, which plays an important role in mechanical protection. External signal and electrical connection, heat dissipation and optical parameter control and other key functions. In this paper, the efficiency, spatial color uniformity and color rendering index of LED are systematically described from the point of view of encapsulation. Specifically, the key technologies in packaging include the following three aspects: 1) Heat design. About 60% of the input electric energy of LED is converted into heat in the process of operation. If the generated heat can not be effectively distributed to the environment in a timely and effective manner, This will cause a sharp rise in the temperature of LED, resulting in a decrease in the efficiency of LED and a reliability problem. (2) Optical design. Led light is generated from the active layer of the chip by electron-hole recombination, after passing through the chip, the phosphor. After encapsulating materials such as glue and lens, the direction and path of light propagation will change due to scattering and refraction. In addition, part of the light is absorbed and converted into heat due to absorption. Therefore, the optical design can not only regulate the energy distribution of LED light source, but also reduce the absorption of light in packaging materials, thus improving the light efficiency. Compared with the combination of polychromatic luminescent LED chips, the desired optical quality LED packaging form can be obtained. The packaging of monochromatic or polychromatic phosphors coated on monochromatic LED chips has been widely used in the industrial production of LED because of its strong correlation color temperature tunability and process flexibility. For the white LED packaging of phosphor binding chip, phosphor coating plays a key role in controlling spatial color uniformity and color rendering index.
【作者單位】： 華中科技大學(xué)能源與動(dòng)力工程學(xué)院;
【基金】：國家自然科學(xué)基金(51625601,51576078,51606074)資助項(xiàng)目
【分類號(hào)】：TN312.8

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