本文選題：3D組裝　切入點(diǎn)：毛紐扣　出處：《哈爾濱工業(yè)大學(xué)》2015年碩士論文

【摘要】：隨著電子設(shè)備向著小型化、多功能的方向發(fā)展,在二維平面組裝上已達(dá)到技術(shù)極限,人們將目光轉(zhuǎn)向三維立體組裝技術(shù),三維立體組裝可以提高封裝密度,大幅度減少設(shè)備尺寸,提供更多的I/O端口,對(duì)于實(shí)現(xiàn)設(shè)備的小型化具有重要意義,成為目前組裝技術(shù)研究的熱點(diǎn)。本文將研究三維立體組裝技術(shù)中的面陣列垂直互連技術(shù)。利用雙面凸點(diǎn)轉(zhuǎn)接板鍵和技術(shù)、毛紐扣垂直互連技術(shù)實(shí)現(xiàn)三層電路板的立體組裝。首先研究了三種不同材料毛紐扣的力學(xué)和電學(xué)特性,之后利用重熔法制備可供立體組裝使用的大尺寸焊球,并利用激光植球?qū)崿F(xiàn)了轉(zhuǎn)接板的制備。利用兩種垂直互連方式實(shí)現(xiàn)了三層電路板的立體組裝。并對(duì)其進(jìn)行了高低溫?zé)釠_擊試驗(yàn)和隨機(jī)振動(dòng)試驗(yàn)。最后利用有限元模擬軟件ANSYS模擬了三維立體組裝電路在高低溫?zé)釠_擊和隨機(jī)振動(dòng)試驗(yàn)中的響應(yīng),找出了結(jié)構(gòu)的薄弱環(huán)節(jié)。研究結(jié)果表明:毛紐扣的力學(xué)特性具有非線性的特點(diǎn),彈性模量分為三個(gè)階段分別對(duì)應(yīng)毛紐扣在不同應(yīng)變下金屬絲的三種接觸方式,得到了其力學(xué)模型。毛紐扣的電阻R和應(yīng)變的倒數(shù)1/分兩個(gè)階段成線性關(guān)系。Au/Be Cu毛紐扣具有較好的彈性和抗振性,Au/Mo毛紐扣具有良好的高溫穩(wěn)定性,Au/Be Cu-Mo雙絲復(fù)合毛紐扣兼?zhèn)淦渌麅煞N毛紐扣的特點(diǎn)。利用重熔法制備的大焊球,在較短的重熔時(shí)間下其內(nèi)部組織較為細(xì)密,富鉛相分布均勻,與原始焊球無明顯差異。在熱沖擊試驗(yàn)后,轉(zhuǎn)接板邊角處的焊點(diǎn)最易發(fā)生失效,裂紋首先出現(xiàn)在靠近A、B電路板一側(cè),萌生在釬料基體靠近焊盤的位置,并平行于焊盤方向擴(kuò)展。在振動(dòng)試驗(yàn)中,小尺寸焊點(diǎn)的斷裂位置在焊盤和PCB板之間,采用大尺寸焊球的三維組裝電路未發(fā)生斷裂。ANSYS有限元分析結(jié)果表明:在邊角位置的焊點(diǎn)應(yīng)力最大,最易失效,與試驗(yàn)結(jié)果一致。隨機(jī)振動(dòng)試驗(yàn)表明A層電路板最易發(fā)生共振,靠近A層電路板中心區(qū)域在轉(zhuǎn)接板中間的焊點(diǎn)具有最大的加速度,但是在邊角處的焊點(diǎn)具有最大的應(yīng)力,是系統(tǒng)的薄弱環(huán)節(jié)。
[Abstract]:With the development of electronic equipment towards miniaturization and multi-function, the technology limit has been reached in two-dimensional plane assembly. People turn their attention to three-dimensional assembly technology, which can improve the packaging density. Greatly reducing the size of the device and providing more I / O ports is of great significance to the miniaturization of the device. In this paper, we will study the surface array vertical interconnection technology in three-dimensional assembly technology. The vertical interconnect technology of wool buttons is used to realize the three-dimensional assembly of three-layer circuit boards. Firstly, the mechanical and electrical properties of three different materials of wool buttons are studied, and then the large size solder balls for stereoscopic assembly are prepared by remelting method. The fabrication of the switch board was realized by using laser ball planting. The three-dimensional assembly of the three-layer circuit board was realized by two vertical interconnection methods. The thermal shock test and random vibration test were carried out at high and low temperature. Finally, the finite element method was used. The simulation software ANSYS simulates the response of three-dimensional assembly circuit to high and low temperature thermal shock and random vibration test. The results show that the mechanical properties of wool buttons are nonlinear, and the elastic modulus is divided into three stages corresponding to three contact modes of wool buttons under different strain. The mechanical model is obtained. The resistance R of hair button and the reciprocal of strain are linear in two stages. Au-be-Cu hair button has good elasticity and vibration resistance. Au-Mo button has good high temperature stability and high temperature stability. Features of two other types of hairy buttons. Large solder balls prepared by remelting, Under the short remelting time, the internal structure is finer, the lead-rich phase distribution is uniform, and there is no obvious difference from the original welding ball. After the thermal shock test, the solder joint at the edge corner of the plate is most likely to fail. The crack occurs at first near the side of the AZB circuit board and originates in the position of the solder matrix near the pad and extends parallel to the pad direction. In vibration tests, the fracture position of the small size solder is between the pad and the PCB plate. The results of finite element analysis show that the stress of solder joint at the edge angle is the largest and the most likely to fail, which is consistent with the test results. The random vibration test shows that the A layer circuit board is the most prone to resonance. The solder joint near the center of the A layer circuit board has the largest acceleration, but the solder joint at the edge corner has the biggest stress, which is the weak link of the system.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN05

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本文編號(hào)：1665008