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微器件的制作和微電鑄均勻性的研究

發(fā)布時間:2018-03-19 02:22

  本文選題:MEMS 切入點:微針 出處:《大連理工大學》2015年碩士論文 論文類型:學位論文


【摘要】:微型化、集成化和便攜化是科技發(fā)展的一種趨勢,微機電系統(tǒng)(Micro Electro Mechanical System, MEMS)工藝是實現(xiàn)器件微型化、集成化和便攜化的重要手段。在MEMS眾多研究方向中,因生物MEMS應用潛力大、科技優(yōu)勢顯著成為研究的熱點之一。其中基于MEMS工藝的微針和微流控芯片是生物MEMS醫(yī)學應用研究的典型器件。背面曝光技術和微電鑄技術分別是制作微針和微流控芯片模具的關鍵技術,然而背面曝光制作微針的技術尚不成熟,電鑄技術也存在著鑄層厚度不均勻的問題,嚴重制約了微針和微流控芯片在生物醫(yī)學方面的應用。本文使用模擬軟件Matlab和COMSOL并結合實驗研究,探究優(yōu)化基于背面曝光工藝制作微針的成型方法和改善電沉積均勻性的可行性措施。本文的研究工作可以為MEMS生物醫(yī)學的進一步發(fā)展積累經(jīng)驗。本文基于標量角譜衍射理論,利用Matlab軟件進行了圓孔衍射的模擬,確定了定值圓孔制作微針的最佳衍射光場范圍。通過調(diào)整基底厚度、曝光劑量等參數(shù),制作了高度從265μm到380μm,傾角從5.1°到15.6°,底端直徑遠大于掩膜版上對應圓孔直徑的SU-8膠微針陣列。用微針側壁傾角和頂部直徑與掩膜版上圓孔直徑的比值R評價微針的尖銳程度,分析并討論了實驗中遇到的問題。利用電沉積理論和法拉第第一定律推導了電流密度分布與鑄層厚度分布的關系;陔娏髅芏葦(shù)值分布模型,采用COMSOL模擬軟件,研究了輔助陰極對陰極電力線和電流密度分布的影響并對輔助陰極結構進行了優(yōu)化,預測了鑄層形貌。為驗證仿真結果,采用控制變量法設計了比對實驗,用電感測微儀測量了電鑄后的鑄層厚度,實驗結果與仿真結果趨勢相同,結果表明:微電鑄模具的鑄層厚度不均勻度由142.0%縮減至68.9%;谖㈦婅T技術制作了厚度為200μm的鎳金屬模具。為實現(xiàn)微流控芯片模具的納米結構定域加工,改善其表面性能,使用飛秒激光加工技術在鎳模具表面加工了微納米結構,實現(xiàn)了鎳模具部分表面由親水性向疏水性的轉變。使用熱壓印技術實現(xiàn)了微納米結構從鎳模具到PMMA的精確復制和轉移,使用水預處理鍵合技術提高了PMMA微流控芯片的鍵合率,最后使用CO2激光加工技術對鍵合后的芯片進行了外形輪廓的加工,制得了應用于病原微生物檢測的微流控芯片。
[Abstract]:Miniaturization, integration and portability are a trend in the development of science and technology. MEMS Micro Electro Mechanical system is an important means to realize the miniaturization, integration and portability of devices. The advantage of science and technology has become one of the hotspots in the research. Microneedle and microfluidic chip based on MEMS process are typical devices in biomedical application of MEMS. Back exposure technology and microelectroforming technology are the fabrication of microneedle and microflow, respectively. The key technology of controlling chip mould, However, the technology of making microneedle by back exposure is not mature, and the electroforming technology also has the problem of uneven thickness of casting layer. The application of microneedle and microfluidic chip in biomedicine is seriously restricted. In this paper, the simulation software Matlab and COMSOL are used in combination with experimental research. This paper explores the feasibility measures to optimize the fabrication of microneedles based on the back exposure process and to improve the uniformity of electrodeposition. The research work in this paper can accumulate experience for the further development of MEMS biomedicine. This paper is based on the scalar angular spectrum diffraction theory. The Matlab software is used to simulate the diffraction of circular holes, and the optimum range of diffraction light field is determined. By adjusting the thickness of the substrate, the exposure dose and other parameters, the optimum range of diffraction light field is determined. A SU-8 microneedle array with a height of 265 渭 m to 380 渭 m and a dip angle of 5.1 擄to 15.6 擄was fabricated. The diameter of the bottom end was much larger than the corresponding diameter of the circular hole on the mask plate. The sharp degree of the microneedle was evaluated by the inclination angle of the sidewall of the microneedle and the ratio of the top diameter to the diameter of the hole on the mask plate. The relationship between the distribution of current density and the thickness distribution of cast layer is derived by using the theory of electrodeposition and Faraday's law. Based on the model of numerical distribution of current density, the simulation software COMSOL is used. The influence of the auxiliary cathode on the distribution of power line and current density of the cathode is studied, and the structure of the auxiliary cathode is optimized, and the shape of the cast layer is predicted. In order to verify the simulation results, the control variable method is used to design the comparison experiment. The thickness of the cast layer was measured by electroforming micrometer. The experimental results are the same as the simulation results. The results show that the thickness inhomogeneity of cast layer of microelectroforming die is reduced from 142.0% to 68.9. Based on microelectroforming technology, nickel metal dies with thickness of 200 渭 m have been fabricated. Using femtosecond laser processing technology, the micro and nano structure was fabricated on the surface of nickel mould, and the partial surface of nickel mould was changed from hydrophilicity to hydrophobicity. The accurate replication and transfer of micro and nano structure from nickel mould to PMMA was realized by hot stamping technology. The bonding rate of PMMA microfluidic chip was improved by water pretreatment bonding technology. Finally, the profile of the bonded microfluidic chip was processed by CO2 laser processing technology, and the microfluidic chip was prepared for the detection of pathogenic microorganism.
【學位授予單位】:大連理工大學
【學位級別】:碩士
【學位授予年份】:2015
【分類號】:TN492

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