發(fā)布時間：2018-01-16 10:27

  本文關(guān)鍵詞：PCB板級共模噪聲抑制方法研究　出處：《浙江大學》2016年碩士論文　論文類型：學位論文

  更多相關(guān)文章： 電磁兼容 共模噪聲 差分鏈路 共模濾波器 低腔功率放大器 高阻抗表面

【摘要】：隨著電子信息技術(shù)的快速發(fā)展,電子系統(tǒng)的速率和集成度都在不斷提高,電磁兼容(EMC, Electromagnetic Compatibility)問題面臨越來越多的挑戰(zhàn)。共模噪聲是電磁干擾(]EMI, Electromagnetic Interference)的重要來源,其抑制技術(shù)一直是電磁兼容領(lǐng)域的研究熱點。高速電路和射頻電路都有受到共模噪聲影響的風險。作為專業(yè)碩士論文,緊密結(jié)合華為公司的實際產(chǎn)品,針對其遇到的PCB板級高速鏈路和射頻電路共模噪聲干擾問題進行了研究,對現(xiàn)有技術(shù)進行改進和創(chuàng)新,設(shè)計了滿足工程需求的差分鏈路共模濾波器,并且將高阻抗表面應(yīng)用于射頻功放腔體內(nèi)部的共模噪聲抑制。高速差分鏈路攜帶的共模噪聲極易造成EMI超標。隨著PCB布線密集程度的增加以及干擾噪聲頻率的升高,現(xiàn)有的噪聲抑制技術(shù)已經(jīng)無法滿足工程需求。通過在PCB上設(shè)計在板共模濾波器濾除共模噪聲的方法早已被提出,但是目前的技術(shù)主要被應(yīng)用在10GHz以下噪聲的濾除,而且并未研究各種濾波器在工程應(yīng)用中的局限性。本文針對線寬和線距只有5～7mil的高速差分鏈路設(shè)計10GHz和25GHz共模濾波器。首先對濾波器位于差分線參考地上的常見結(jié)構(gòu)進行設(shè)計分析,發(fā)現(xiàn)該類結(jié)構(gòu)對PCB加工中的層間錯位極為敏感,導致其在工程中的應(yīng)用受到限制。繼而提出了濾波器與差分線位于同一層的共面型結(jié)構(gòu),但是由于目前加工工藝的限制使得差分線和濾波器的間距無法做到很小造成濾波器的帶寬很窄無法滿足工程需求。最終,本文通過在差分線下增加刻槽將共面型濾波器的-10dB帶寬拓寬了5倍以上,并且通過優(yōu)化消除了了引入濾波器后造成的SI問題,使得該結(jié)構(gòu)滿足工程應(yīng)用的要求,并設(shè)計了高頻測試單板用測試結(jié)果驗證了其有效性。本文還針對射頻功放受到共模噪聲干擾問題進行了分析,通過場路混合建模法對包含金屬屏蔽腔的功放模塊進行建模,通過仿真與理論分析確定了功放增益惡化的原因是由于輸出匹配節(jié)的噪聲耦合到輸入匹配節(jié)并再次放大。本文將以上共模濾波器擴展為高阻抗表面,在腔體內(nèi)表面放置高阻抗表面,利用其抑制表面波的特性成功地減小了腔體內(nèi)共模噪聲的耦合,使得加上屏蔽腔后的功放增益更接近于無腔環(huán)境下的增益,并通過實驗驗證了其性能。同時,本文還通過相位補償法實現(xiàn)了功放增益的改善。
[Abstract]:With the rapid development of electronic information technology, the speed and integration of electronic system are improving, EMC is EMC. The problem of Electromagnetic compatibility is facing more and more challenges. Common-mode noise is electromagnetic interference (] EMI. An important source of Electromagnetic interference. High speed circuits and radio frequency circuits have the risk of being affected by common mode noise. As a master's thesis, it is closely combined with the actual products of Huawei. The common mode noise interference of PCB board high speed link and radio frequency circuit is studied, the existing technology is improved and innovated, and a differential link common mode filter is designed to meet the engineering requirements. The high impedance surface is applied to the common mode noise suppression in the RF power amplifier cavity. The common mode noise carried by the high speed differential link is easy to cause the EMI to exceed the standard. With the increase of the PCB wiring density and the interference noise, it is easy to cause the common mode noise in the RF power amplifier cavity. Increased frequency. The existing noise suppression technology has been unable to meet the needs of engineering. The method to filter the common-mode noise by designing a common-mode filter on the PCB has been proposed for a long time. However, the current technology is mainly used in the filtering of noise below 10GHz. In this paper, 10GHz and 25GHz common mode filters are designed for high-speed differential links with line width and line spacing of only 5 mil. The common structures located on the reference ground of the differential line are designed and analyzed. It is found that this kind of structure is very sensitive to the interlaminar dislocation in PCB machining, so its application in engineering is restricted. Then, a coplanar structure with the same filter and difference line is proposed. However, due to the current processing technology constraints, the difference line and filter spacing can not be very small, the filter bandwidth is very narrow can not meet the requirements of the project. In this paper, the coplanar filter bandwidth of -10dB is expanded by adding grooves under the difference line, and the SI problem caused by the introduction of the filter is eliminated by optimization. The structure meets the requirements of engineering application, and the test results of high-frequency test veneer are designed to verify its effectiveness. In addition, the common mode noise interference problem of RF power amplifier is analyzed in this paper. The power amplifier module containing metal shielding cavity is modeled by field circuit hybrid modeling method. Through simulation and theoretical analysis, it is determined that the reason for the gain deterioration of the amplifier is that the noise of the output matching section is coupled to the input matching node and amplified again. In this paper, the common-mode filter is extended to a high impedance surface. The high impedance surface is placed on the inner surface of the cavity, and the coupling of the common mode noise in the cavity is successfully reduced by using the characteristic of suppressing the surface wave, which makes the gain of the power amplifier after adding the shielded cavity closer to the gain in the environment without the cavity. The performance of the amplifier is verified by experiments, and the gain of power amplifier is improved by phase compensation.
【學位授予單位】：浙江大學
【學位級別】：碩士
【學位授予年份】：2016
【分類號】：TN41;TN03

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