【摘要】：采用機(jī)械合金化法制備了Cu基復(fù)合材料,研究了球磨時(shí)間、壓制壓強(qiáng)、燒結(jié)溫度和燒結(jié)時(shí)間對(duì)復(fù)合材料粉末粒度、抗彎強(qiáng)度和電阻系數(shù)的影響。結(jié)果表明,Cu基復(fù)合材料的最佳制備工藝為:球磨時(shí)間40 h,壓制壓強(qiáng)400 MPa,燒結(jié)溫度900℃和燒結(jié)時(shí)間為2.5 h,此時(shí)Cu基復(fù)合材料可以取得最佳的抗彎強(qiáng)度和電阻系數(shù)。
[Abstract]:The effects of milling time, pressing pressure, sintering temperature and sintering time on the particle size, bending strength and resistance coefficient of Cu matrix composites were studied. The results show that the optimum preparation process of Cu matrix composites is as follows: milling time 40 h, pressing pressure 400 MPA, sintering temperature 900 鈩，

本文編號(hào)：2133111