本文選題：低溫固化 + 導電銀漿�。� 參考：《粉末冶金材料科學與工程》2017年04期

【摘要】：用銀粉作為導電填料,與F型環(huán)氧樹脂、稀釋劑、固化劑等配制成樹脂基導電銀漿,將導電銀漿印刷在載玻片上,在一定溫度下固化后得到導電銀漿固化膜。通過對薄膜體積電阻率進行測定,以及SEM觀察和傅里葉變換紅外光譜分析,研究稀釋劑種類、稀釋劑含量、固化溫度和固化時間等因素對導電銀漿固化薄膜結(jié)構(gòu)與電阻率的影響。結(jié)果表明:松油醇對導電銀漿稀釋效果好,得到附著力和硬度均較高的固化膜,松油醇含量(質(zhì)量分數(shù))為8%時,薄膜的體積電阻率達到3.9×10~(-5)?·cm;提高固化溫度可降低薄膜的體積電阻率,但溫度超過130℃時,電阻率降低不明顯;延長固化時間可提高銀漿薄膜的導電性能,但當時間達到40 min后,電阻率基本不再隨時間延長而發(fā)生變化。
[Abstract]:The conductive silver paste based on resin was prepared by using silver powder as conductive filler with F type epoxy resin diluent and curing agent. The conductive silver paste was printed on the glass slide and cured at a certain temperature to obtain the conductive silver paste curing film. By measuring the volume resistivity of thin films, SEM observation and Fourier transform infrared spectroscopy (FTIR), the kinds of diluents and the content of diluents were studied. Effects of curing temperature and curing time on the structure and resistivity of conductive silver paste film. The results show that terpineol has a good dilution effect on conductive silver paste, and a solidified film with high adhesion and hardness is obtained. When the content of terpineol (mass fraction) is 8, The volume resistivity of the film is 3.9 脳 10 ~ (-5)? cm, the volume resistivity of the film can be decreased by increasing the curing temperature, but when the temperature is over 130 鈩，

本文編號：1968938