【摘要】：SU-8膠是一種在微機(jī)電系統(tǒng)(MEMS)中廣泛應(yīng)用的負(fù)性光刻膠。由于其獨(dú)特的光學(xué)性能、力學(xué)性能和化學(xué)性能,以及SU-8膠光刻技術(shù)相對于LIGA(lithographie, galvanoformung and abformung)技術(shù)成本低,已被廣泛的應(yīng)用于MEMS傳感器與執(zhí)行器的制作中,在微細(xì)制造領(lǐng)域正受到了越來越多的關(guān)注。在MEMS工藝中,SU-8膠薄膜尤其是作為結(jié)構(gòu)層使用時(shí),其力學(xué)性能對MEMS器件制作的成敗及性能的好壞至關(guān)重要。在MEMS薄膜材料力學(xué)參數(shù)中,主要包括材料的內(nèi)應(yīng)力,應(yīng)力梯度,泊松比以及楊氏模量等。 本文在基于圓形薄膜結(jié)構(gòu)測量應(yīng)力梯度原理的基礎(chǔ)上提出了一種乒乓球拍形測試結(jié)構(gòu)測量SU-8薄膜的應(yīng)力梯度,并通過CoventorWare軟件對乒乓球拍形結(jié)構(gòu)測量理論的正確性進(jìn)行了仿真驗(yàn)證。仿真計(jì)算得到,當(dāng)圓膜的最大形變小于圓膜厚度的1/4倍時(shí),應(yīng)力梯度的測量誤差小于1%。 本文還提出了一種基于犧牲層技術(shù)的SU-8膠MEMS結(jié)構(gòu)加工工藝,加工出的SU-8乒乓球拍測試結(jié)構(gòu)中沒有裂紋,且被釋放的結(jié)構(gòu)層未與襯底發(fā)生粘連。采用顯微干涉技術(shù)拍攝測試結(jié)構(gòu)釋放后的干涉圖,由干涉圖通過最小二乘法擬合計(jì)算出釋放后測試結(jié)構(gòu)的曲率半徑,從而計(jì)算出應(yīng)力梯度。顯微干涉測量方法屬于非接觸式測量,不僅重復(fù)性好,不會損害測試結(jié)構(gòu),而且適用于導(dǎo)電材料與非導(dǎo)電材料力學(xué)參數(shù)的在線測量。 本文分別制作了SU-8膠的乒乓球拍形測試結(jié)構(gòu)和懸臂梁測試結(jié)構(gòu),并測量計(jì)算出它們的應(yīng)力梯度進(jìn)行比較,實(shí)驗(yàn)結(jié)果表明,采用乒乓球拍結(jié)構(gòu)測量應(yīng)力梯度的重復(fù)性很好,而已有的采用懸臂梁測試結(jié)構(gòu)測量應(yīng)力梯度的重復(fù)性較差,因此,乒乓球拍形測試結(jié)構(gòu)要比懸臂梁測試結(jié)構(gòu)更適用于應(yīng)力梯度測量。 本文還采用微梁旋轉(zhuǎn)法對SU-8薄膜的應(yīng)力進(jìn)行了測量。通過顯微鏡拍攝出形變的照片,測量出SU-8測試結(jié)構(gòu)釋放后指針的偏轉(zhuǎn)量,從而計(jì)算出SU-8薄膜的應(yīng)力。
[Abstract]:SU-8 adhesive is a kind of negative photoresist widely used in MEMS (MEMS). Because of its unique optical, mechanical and chemical properties, and the low cost of SU-8 photoetching compared with LIGA (lithographie, galvanoformung and abformung), it has been widely used in the fabrication of MEMS sensors and actuators. More and more attention has been paid in the field of micro manufacturing. In MEMS process, the mechanical properties of SU-8 film, especially when used as a structure layer, are very important to the success or failure of MEMS device fabrication and the quality of its performance. The mechanical parameters of MEMS films mainly include internal stress, stress gradient, Poisson's ratio and Young's modulus. Based on the principle of stress gradient measurement of circular thin film structure, a table tennis bat structure is proposed to measure the stress gradient of SU-8 film. The correctness of table tennis racket shape structure measurement theory is verified by CoventorWare software. Simulation results show that when the maximum deformation of the circular film is less than 1 / 4 times of the thickness of the circular film, the measurement error of the stress gradient is less than 1 / 1. This paper also presents a process of SU-8 MEMS structure based on sacrificial layer technology. There is no crack in the tested structure of SU-8 ping-pong bat, and the released layer does not adhere to the substrate. The interferogram of the test structure was taken by means of microinterferometry, and the curvature radius of the structure was calculated by least square method, and the stress gradient was calculated. The micro-interferometry is a non-contact measurement, which not only has good repeatability and does not damage the testing structure, but also is suitable for on-line measurement of mechanical parameters of conductive materials and non-conductive materials. In this paper, the test structure of ping-pong bat shape of SU-8 glue and the test structure of cantilever beam are made, and their stress gradients are measured and calculated. The experimental results show that the repeatability of measuring stress gradient with table tennis racket structure is very good. However, the repeatability of using cantilever beam to measure stress gradient is poor. Therefore, the test structure of table tennis bat shape is more suitable for measuring stress gradient than cantilever beam test structure. The stress of SU-8 thin film was measured by microbeam rotation method. The deformation photographs were taken by microscope and the deflection of the pointer after the release of the structure was measured by SU-8, and the stress of the SU-8 film was calculated.
【學(xué)位授予單位】：南京師范大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2014
【分類號】：TB383.2;TB302

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