本文關(guān)鍵詞： 超聲振動(dòng) 硬脆材料 金剛石薄鋸片 單晶硅 鋸切比能　出處：《材料科學(xué)與工藝》2017年01期 　論文類型：期刊論文

【摘要】：超聲振動(dòng)能很好地改善硬脆性材料的加工性能,為了探索超聲振動(dòng)鋸切比能對(duì)單晶硅的影響,本文采用薄金剛石鋸片,在有無(wú)超聲振動(dòng)的條件下對(duì)單晶硅進(jìn)行鋸切實(shí)驗(yàn).實(shí)驗(yàn)結(jié)果表明:超聲振動(dòng)使鋸切材料過程中的比能大幅度降低;2種鋸切方式下鋸切比能都隨著單顆磨粒最大鋸切厚度的增大而降低,但普通鋸切方式下鋸切比能呈冪指數(shù)遞減趨勢(shì),而在超聲振動(dòng)的作用下比能變化趨勢(shì)轉(zhuǎn)變?yōu)榱己玫木�性遞減;并且單晶硅材料的去除方式由普通鋸切中塑性去除為主導(dǎo)轉(zhuǎn)變?yōu)榇嘈詳嗔讶コ?其破碎方式屬于微破碎,趨于粉末狀破碎,由此在不會(huì)對(duì)工件表面產(chǎn)生嚴(yán)重?fù)p傷的同時(shí)使材料去除所消耗的能量得到了有效降低.同時(shí),超聲振動(dòng)使得鋸片上的磨粒對(duì)單晶硅表面的高速?zèng)_擊作用,使單晶硅產(chǎn)生大量微裂紋,對(duì)單晶硅的微小剝離起到很大作用.因此,超聲振動(dòng)在單晶硅材料的加工中有著很大的發(fā)展前景.
[Abstract]:Ultrasonic vibration can improve the processing performance of hard brittle materials. In order to explore the effect of ultrasonic vibration sawing specific energy on monocrystalline silicon thin diamond saw blade is used in this paper. The experimental results show that the specific energy in the sawing process is greatly reduced under the condition of ultrasonic vibration or not. The sawing specific energy decreases with the increase of the maximum sawing thickness of a single abrasive, but the sawing specific energy decreases exponentially under the common sawing mode. Under the action of ultrasonic vibration, the change trend of specific energy changed into a good linear decline. And the removal mode of monocrystalline silicon is changed from plastic removal to brittle fracture removal, which belongs to micro-crushing and tends to powder crushing. Therefore, the energy consumed by material removal can be effectively reduced while not causing serious damage to the surface of the workpiece. Meanwhile, ultrasonic vibration makes the abrasive particles on the saw blade impact on the surface of monocrystalline silicon at high speed. A large number of microcracks are produced in monocrystalline silicon, which plays an important role in the microdelamination of monocrystalline silicon. Therefore, ultrasonic vibration has a great development prospect in the processing of monocrystalline silicon materials.
【作者單位】： 華僑大學(xué)機(jī)電及自動(dòng)化學(xué)院;
【基金】：國(guó)家自然科學(xué)基金(51275181) 華僑大學(xué)研究生科研創(chuàng)新能力培育計(jì)劃資助項(xiàng)目(1511303004)
【分類號(hào)】：TN304.12;TB559
【正文快照】： 單晶硅作為一種重要的新型半導(dǎo)體材料,在各個(gè)領(lǐng)域尤其是光伏發(fā)電與電子信息領(lǐng)域中得到了廣泛應(yīng)用,在太陽(yáng)能發(fā)電和集成電路中起到舉足輕重的作用[1-2].單晶硅是一種硬脆材料,具有硬度高、脆性大等特點(diǎn),材料切削加工性能差,零件加工要求高,因此在加工過程中受到了一定的限制,難

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本文編號(hào)：1466121